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Other articles related with "3D-IC"：
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26101 |
Bing Ye(叶兵), Li-Hua Mo(莫莉华), Tao Liu(刘涛), Jie Luo(罗捷), Dong-Qing Li(李东青), Pei-Xiong Zhao(赵培雄), Chang Cai(蔡畅), Ze He(贺泽), You-Mei Sun(孙友梅), Ming-Dong Hou(侯明东), Jie Liu(刘杰) |
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Geant4 simulation of proton-induced single event upset in three-dimensional die-stacked SRAM device |
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Chin. Phys. B
2020 Vol.29 (2): 26101-026101
[Abstract]
(674)
[HTML 1 KB]
[PDF 2745 KB]
(174)
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