中国物理B ›› 2015, Vol. 24 ›› Issue (11): 119401-119401.doi: 10.1088/1674-1056/24/11/119401

• GEOPHYSICS, ASTRONOMY, AND ASTROPHYSICS • 上一篇    

Fin width and height dependence of bipolar amplification in bulk FinFETs submitted to heavy ion irradiation

于俊庭a, 陈书明a b, 陈建军a, 黄鹏程a   

  1. a College of Computer, National University of Defense Technology, Changsha 410073, China;
    b National Laboratory for Parallel and Distributed Processing, National University of Defense Technology, Changsha 410073, China
  • 收稿日期:2015-03-09 修回日期:2015-06-23 出版日期:2015-11-05 发布日期:2015-11-05
  • 通讯作者: Yu Jun-Ting E-mail:yjting_nudt@163.com
  • 基金资助:
    Project supported by the National Natural Science of China (Grant No. 61376109).

Fin width and height dependence of bipolar amplification in bulk FinFETs submitted to heavy ion irradiation

Yu Jun-Ting (于俊庭)a, Chen Shu-Ming (陈书明)a b, Chen Jian-Jun (陈建军)a, Huang Peng-Cheng (黄鹏程)a   

  1. a College of Computer, National University of Defense Technology, Changsha 410073, China;
    b National Laboratory for Parallel and Distributed Processing, National University of Defense Technology, Changsha 410073, China
  • Received:2015-03-09 Revised:2015-06-23 Online:2015-11-05 Published:2015-11-05
  • Contact: Yu Jun-Ting E-mail:yjting_nudt@163.com
  • Supported by:
    Project supported by the National Natural Science of China (Grant No. 61376109).

摘要: FinFET technologies are becoming the mainstream process as technology scales down. Based on a 28-nm bulk p-FinFET device, we have investigated the fin width and height dependence of bipolar amplification for heavy-ion-irradiated FinFETs by 3D TCAD numerical simulation. Simulation results show that due to a well bipolar conduction mechanism rather than a channel (fin) conduction path, the transistors with narrower fins exhibit a diminished bipolar amplification effect, while the fin height presents a trivial effect on the bipolar amplification and charge collection. The results also indicate that the single event transient (SET) pulse width can be mitigated about 35% at least by optimizing the ratio of fin width and height, which can provide guidance for radiation-hardened applications in bulk FinFET technology.

关键词: fin width and height, bipolar amplification, single event transient, bulk FinFET

Abstract: FinFET technologies are becoming the mainstream process as technology scales down. Based on a 28-nm bulk p-FinFET device, we have investigated the fin width and height dependence of bipolar amplification for heavy-ion-irradiated FinFETs by 3D TCAD numerical simulation. Simulation results show that due to a well bipolar conduction mechanism rather than a channel (fin) conduction path, the transistors with narrower fins exhibit a diminished bipolar amplification effect, while the fin height presents a trivial effect on the bipolar amplification and charge collection. The results also indicate that the single event transient (SET) pulse width can be mitigated about 35% at least by optimizing the ratio of fin width and height, which can provide guidance for radiation-hardened applications in bulk FinFET technology.

Key words: fin width and height, bipolar amplification, single event transient, bulk FinFET

中图分类号:  (Radiation processes)

  • 94.05.Dd
85.30.Tv (Field effect devices) 02.60.Cb (Numerical simulation; solution of equations)