中国物理B ›› 2012, Vol. 21 ›› Issue (8): 89401-089401.doi: 10.1088/1674-1056/21/8/089401

• GEOPHYSICS, ASTRONOMY, AND ASTROPHYSICS • 上一篇    下一篇

Temperature and drain bias dependence of single event transient in 25-nm FinFET technology

秦军瑞, 陈书明, 李达维, 梁斌, 刘必慰   

  1. College of Computer, National University of Defense Technology, Changsha 410073, China
  • 收稿日期:2011-11-28 修回日期:2011-12-20 出版日期:2012-07-01 发布日期:2012-07-01
  • 基金资助:
    Project supported by the State Key Program of the National Natural Science of China (Grant No. 60836004) and the National Natural Science Foundation of China (Grant Nos. 61076025 and 60906014).

Temperature and drain bias dependence of single event transient in 25-nm FinFET technology

Qin Jun-Rui (秦军瑞), Chen Shu-Ming (陈书明), Li Da-Wei (李达维), Liang Bin (梁斌), Liu Bi-Wei (刘必慰 )   

  1. College of Computer, National University of Defense Technology, Changsha 410073, China
  • Received:2011-11-28 Revised:2011-12-20 Online:2012-07-01 Published:2012-07-01
  • Contact: Qin Jun-Rui E-mail:qinjr@nudt.edu.cn
  • Supported by:
    Project supported by the State Key Program of the National Natural Science of China (Grant No. 60836004) and the National Natural Science Foundation of China (Grant Nos. 61076025 and 60906014).

摘要: In this paper, we investigate the temperature and drain bias dependency of single event transient (SET) in 25-nm fin field-effect-transistor (FinFET) technology in a temperature range of 0-135 ℃ and supply voltage range of 0.4 V-1.6 V. Technology computer-aided design (TCAD) three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135 ℃. The charge collected increases from 45.5 fC to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V. Furthermore, simulation results and the mechanism of temperature and bias dependency are discussed.

关键词: fin field-effect transistor, single event transient, temperature dependence, drain bias dependence

Abstract: In this paper, we investigate the temperature and drain bias dependency of single event transient (SET) in 25-nm fin field-effect-transistor (FinFET) technology in a temperature range of 0-135 ℃ and supply voltage range of 0.4 V-1.6 V. Technology computer-aided design (TCAD) three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135 ℃. The charge collected increases from 45.5 fC to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V. Furthermore, simulation results and the mechanism of temperature and bias dependency are discussed.

Key words: fin field-effect transistor, single event transient, temperature dependence, drain bias dependence

中图分类号:  (Radiation processes)

  • 94.05.Dd
85.30.Tv (Field effect devices) 02.60.Cb (Numerical simulation; solution of equations)