中国物理B ›› 2006, Vol. 15 ›› Issue (11): 2713-2717.doi: 10.1088/1009-1963/15/11/042
吴志猛1, 雷青松1, 奚建平1, 耿新华2, 赵颖2, 孙建2
Wu Zhi-Meng(吴志猛)a)†, Lei Qing-Song(雷青松)a), Geng Xin-Hua(耿新华)b), Zhao Ying(赵颖)b), Sun Jian(孙建)b), and Xi Jian-Ping(奚建平)a)
摘要: This paper reports that the optical emission spectroscopy (OES) is used to monitor the plasma during the deposition process of hydrogenated microcrystalline silicon films in a very high frequency plasma enhanced chemical vapour deposition system. The OES intensities (SiH\sj{*}, H$_\al^*$ and H$_\be^*$) are investigated by varying the deposition parameters. The result shows that the discharge power, silane concentrations and substrate temperature affect the OES intensities. When the discharge power at silane concentration of 4\% increases, the OES intensities increase first and then are constant, the intensities increase with the discharge power monotonously at silane concentration of 6\%. The SiH\sj{*} intensity increases with silane concentration, while the intensities of H$_\al^*$ and H$_\be^*$ increase first and then decrease. When the substrate temperature increases, the SiH\sj{*} intensity decreases and the intensities of H$_\al^*$ and H$_\be^*$ are constant. The correlation between the intensity ratio of $I_{\rm H_\al^*}$/$I_{{\rm SiH}^*}$ and the crystalline volume fraction ($X_{\rm c}$) of films is confirmed.
中图分类号: (Elemental semiconductors and insulators)