[1] Saha J K, Billah M M and Jang J 2021 ACS Appl. Mater. Interfaces 13 37350 [2] Zhang S, Weng L, Liu B, Kuang D, Liu X W, Jiang B Q, Zhang G C, Bao Z C, Yuan G C, Guo J, Ning C, Shi DWand Yu Z N 2023 Vacuum 215 112225 [3] Seul H J, Kim M J, Yang H J, Cho M H, SongWB and Jeong J K 2020 ACS Appl. Mater. Interfaces 12 33887 [4] Nomura K, Ohta H, Takagi A, Kamiya T, Hirano M and Hosono H 2004 Nature 432 488 [5] Xu X, He G, Wang L, Wang W, Jiang S and Fang Z 2023 J. Mater. Sci. Technol. 141 100 [6] Park J, Go S, Chae W, Ryoo C I, Kim C, Noh H, Kim S, Du A B, Cho I T, Yun P S, Bae J U, Park Y S, Kim S and Kim D H 2024 Sci. Rep. 14 10067 [7] Xiong W, Huo J Y, Wu X H, Liu W J, Zhang D W and Ding S J 2023 Chin. Phys. B 32 018503 [8] Song S, Liang H L, Huo W X, Zhang G, Zhang Y H, Wang J W and Mei Z X 2024 Chin. Phys. Lett. 41 068501 [9] Yang G, Song W, Yu Z, Huang T, Cao J, Xu Y, Sun H, Sun W and Wu W 2024 IEEE Trans. Electron Devices 71 2990 [10] Weng L, Zhang S, Kuang D, Liu B, Liu X W, Jiang B Q, Zhang G C, Bao Z C, Ning C, Shi D W, Guo J, Yuan G C and Yu Z N 2023 IEEE Trans. Electron Devices 70 4186 [11] Um J G, Jeong D Y, Jung Y, Moon J K, Jung Y H, Kim S, Kim S H, Lee J S and Jang J 2018 Adv. Electron. Mater. 5 1800617 [12] Huang W C, Li Y, Chang N H, Hong W J, Wu S Y, Liao S Y, Hsueh W J, Wang C M and Huang C Y 2024 Sens. Actuators B: Chem. 417 136175 [13] Kim M Y, Kim H W, Oh C, Park S H and Kim B S 2023 ACS Appl. Mater. Interfaces 6 435 [14] Lee S H, Lee S, Jang S C, On N, Kim H S and Jeong J K 2021 J. Alloys Compd. 862 158009 [15] Kwon J Y and Jeong J K 2015 Semicond. Sci. Technol. 30 024002 [16] He F, Wang Y, Yuan H, Lin Z, Su J, Zhang J, Chang J and Hao Y 2021 Ceram. Int. 47 35029 [17] Han Z, Han J and Abliz A 2024 Appl. Surf. Sci. 648 158995 [18] Wu J L, Lin H Y, Su B Y, Chen Y C, Chu S Y, Liu S Y, Chang C C and Wu C J 2014 J. Alloys Compd. 592 35 [19] Lee H, Lee S, Kim Y, Siddik A B, Billah M M, Lee J and Jang J 2020 IEEE Electron Device Lett. 41 1520 [20] Park J C and Lee H N 2012 IEEE Electron Device Lett. 33 818 [21] Bae S D, Kwon S H, Jeong H S and Kwon H I 2017 Semicond. Sci. Technol. 32 075006 [22] Shan F, Lee J Y, Kim H S, Sun H Z, Choi S G, Heo K J, Koh J H and Kim S J 2021 Electron. Mater. Lett. 17 222 [23] Cheng J, Yu Z, Li X, Guo J, Yan W, Xue J and Xue W 2018 IEEE Trans. Electron Devices 65 136 [24] Hu M, Xu L, Zhang X, Song Z and Luo S 2022 Appl. Surf. Sci. 604 154621 [25] Kim J W and Lee S Y 2024 J. Korean Ceram. Soc. 61 941 [26] Nguyen A H T, Nguyen M C, Nguyen A D, Park N H, Jeon S J, Kwon D and Choi R 2023 IEEE Trans. Electron Devices 70 1085 [27] Zhou X, Han D, Dong J, Li H, Yi Z, Zhang X and Wang Y 2020 IEEE Electron Device Lett. 41 569 [28] Park J M, Kim H D, Jang S C, Kim M J, Chung K B, Kim Y J and Kim H S 2020 IEEE Trans. Electron Devices 67 4924 [29] Zhang S, Liu B, Zhang X, Wen C Y, Sun H R, Liu X W, Yao Q, Zi X R, Bao Z C, Xiao Z R, Zhang Y S, Yuan G C, Guo J, Ning C, Shi D W, Wang F and Yu Z N 2024 Mater. Sci. Semicond. Process 173 108093 [30] Kim J, Park J B, Zheng D, Kim J S, Cheng Y, Park S K, Huang W, Marks T J and Facchetti A 2022 Adv. Mater. 34 2205871 [31] Zhang Q, Xia G, Li H, Sun Q, Gong H andWang S 2024 Nanotechnology 35 125202 [32] Liu A, Liu G, Zhu H, Shin B, Fortunato E, Martins R and Shan F 2016 J. Mater. Chem. C 4 4478 [33] Kai Y, Zhao Y, Wang J, Lu C, Shan Y, Guo Z, Jiang C and Li L 2022 IEEE Electron Device Lett. 43 1681 [34] Chen Y, Duan X, Ma X, Yuan P, Jiao Z, Shen Y, Chai L, Luan Q, Xiang J, Geng D, Wang G and Zhao C 2024 J. Semicond. 45 072301 [35] Xiao N, Yuvaraja S, Chettri D, Liu Z, Lu Y, Liao C, Tang X and Li X 2023 J. Phys. D: Appl. Phys. 56 425102 [36] Xiao B, Yu X and Watanabe S 2019 ACS Appl. Electron. Mater. 1 585 [37] You B C, Wang S J, Ko R M, Wu J H and Lin C E 2020 Jpn. J. Appl. Phys. 59 SGGJ03 [38] Lee K M, Kim N, Lee J K, Lee H J, Kim S Y and Kim T G 2025 Appl. Surf. Sci. 686 162102 [39] Socratous J, Banger K K, Vaynzof Y, Sadhanala A, Brown A D, Sepe A, Steiner U and Sirringhaus H 2015 Adv. Funct. Mater. 25 1873 [40] Nomura K, Kamiya T, Ohta H, Ueda K, Hirano M and Hosono H 2004 Appl. Phys. Lett. 85 1993 [41] Kamiya T, Nomura K and Hosono H 2009 J. Disp. Technol. 5 462 [42] Kim D G, Lee W B, Lee S, Koh J, Kuh B and Park J S 2023 ACS Appl. Mater. Interfaces 15 36550 [43] Zhang T, Wei Y F, Zhang C S, He G, Li T J and Lin D 2024 ACS Appl. Mater. Interfaces 16 36577 |