[1] |
Cha S Y, Kim H J and Choi D J 2010 3rd International Nanoelectronics Conference (INEC), January 3-8, Hong Kong, China, p. 1210
|
[2] |
Monzio Compagnoni C, Spinelli A S, Gusmeroli R, Lacaita A L, Beltrami S, Ghetti A and Visconti A 2007 IEEE International Electron Devices Meeting, December 10-12, Washington, USA, p. 165
|
[3] |
Albert F, Seol K S, Na J H, Hur S H, Choi J D and Kim K 2009 IEEE International Electron Devices Meeting (IEDM), December 7-9, Baltimore, USA, p. 1
|
[4] |
Carmona M, Lopez L, Ogier J and Goguenheim D 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW), October 12-16, South Lake Tahoe, USA, p. 147
|
[5] |
Padovani A, Larcher L, Marca V D, Pavan P, Park H and Bersuker G 2011 J. Appl. Phys. 110 014505
doi: 10.1063/1.3602999
|
[6] |
Toledano-Luque M, Degraeve R, Zahid M B, Kaczer B, Kittl J, Jurczak M, Groeseneken G and Van Houdt J 2009 IEEE International Electron Devices Meeting (IEDM), December 7-9, Baltimore, USA, p. 1
|
[7] |
Oh D, Lee B, Kwon E, Kim S, Cho G, Park S, Lee S and Hong S 2015 IEEE International Memory Workshop (IMW), May 17-20, Monterey, USA, p. 1
|
[8] |
Lee K and Shin H 2017 IEEE Trans. Dev. Mater. Reliab. 17 758
doi: 10.1109/TDMR.2017.2772046
|
[9] |
Vianello E, Driussi F, Esseni D, Selmi L, Duuren M J V and Widdershoven F 2006 European Solid-State Device Research Conference, September 19-21, Montreux, Switzerland, p. 403
|
[10] |
Zimmerman W 1973 Electron. Lett. 9 378
doi: 10.1049/el:19730279
|
[11] |
Cuevas A, Stocks M, McDonald D, Kerr M and Samundsett C 1999 IEEE Trans. Electron Dev. 46 2026
doi: 10.1109/16.791992
|
[12] |
Masetti G, Severi M and Solmi S 1983 IEEE Trans. Electron Dev. 30 764
doi: 10.1109/T-ED.1983.21207
|
[13] |
Arora N D, Hauser J R and Roulston D J 1982 IEEE Trans. Electron Dev. 29 292
doi: 10.1109/T-ED.1982.20698
|
[14] |
Barnes J J, Lomax R J and Haddad G I 1976 IEEE Trans. Electron Dev. 23 1042
doi: 10.1109/T-ED.1976.18533
|
[15] |
Meinerzhagen B and Engl W L 1988 IEEE Trans. Electron Dev. 35 689
doi: 10.1109/16.2514
|
[16] |
Swain R, Jena K and Lenka T R 2016 IEEE Trans. Electron Dev. 63 2346
doi: 10.1109/TED.2016.2555851
|
[17] |
Lau W S, Wong O Y and Wong H 2013 IEEE International Conference of Electron Devices and Solid-state Circuits, June 3-5, Hong Kong, China, p. 1
|
[18] |
Southwick R G, Reed J, Buu C, Butler R, Bersuker G and Knowlton W B 2010 IEEE Trans. Dev. Mater. Reliab. 10 201
doi: 10.1109/TDMR.2009.2039215
|
[19] |
Masetti G, Severi M and Solmi S 1983 IEEE Trans. Electron Dev. 30 764
doi: 10.1109/T-ED.1983.21207
|
[20] |
Schenk A and Heiser G 1997 J. Appl. Phys. 81 7900
doi: 10.1063/1.365364
|
[21] |
Fossum J G, Mertens R P and Lee D S 1983 Solid-State Electron. 26 569
doi: 10.1016/0038-1101(83)90173-9
|
[22] |
Swain R, Jena K and Lenka T R 2016 IEEE Trans. Electron Dev. 63 2346
doi: 10.1109/TED.2016.2555851
|
[23] |
Blauwe J, Houdt J V, Wellkens D, Groeseneken G and Maes H E 1998 IEEE Trans. Electron Dev. 45 1745
doi: 10.1109/16.704374
|
[24] |
You J H, Kim H W, Kim D H, Kim T W and Lee K W 2011 International Conference on Simulation of Semiconductor Processes and Devices, September 8-10, Osaka, Japan, p. 199
|
[25] |
Yin Y, Wu J, Lan L, Li X and Wang Q 2013 IEEE International Conference on Solid Dielectrics (ICSD), June 30-July 4, Bologna, Italy, p. 726
|
[26] |
Najam F, Yu Y S, Cho K H, Yeo K H, Kim D, Hwang J S, Kim S and Hwang S W 2013 IEEE Trans. Electron Dev. 60 2457
doi: 10.1109/TED.2013.2268193
|
[27] |
Kamohara S, Park D and Hu C 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual), March 31-April 2, Reno, USA, p. 57
|
[28] |
Yamada R, Mori Y, Okuyama Y, Yugami J, Nishimoto T and Kume H 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual, April 10-13, San Jose, USA, p. 200
|
[29] |
Driussi F, Iob R, Esseni D, Selmi L, Schaijk R V and Widdershoven F 2004 IEEE Trans. Electron Dev. 51 1570
doi: 10.1109/TED.2004.834899
|
[30] |
Suehle J S and Chaparala P 1997 IEEE Trans. Electron Dev. 44 801
doi: 10.1109/16.568042
|
[31] |
Strong A W, Wu E Y, Vollertsen R P, Sune J, Rosa G L, Sullivan T D and Rauch S E 2009 Reliability Wearout Mechanisms in Advanced CMOS Technologies (Hoboken: John Wiley & Sons) p. 272
|
[32] |
Chaneliere C, Autran J L and Devine R A B 1999 J. Appl. Phys. 86 480
doi: 10.1063/1.370756
|
[33] |
Sahhaf S, Degareve R, Roussel P J, Kauerauf T, Kaczer B and Groeseneken G 2007 IEEE Int. Electron Devices Meeting Techn. Digest, December 11-14, San Francisco, USA, p. 501
|
[34] |
Lo V L, Pey K L, Tung C H and Ang D S 2007 Proc. 45th Int. Reliability Physics Sym. IEEE, April 15-19, Phoenix, USA, p. 576
|
[35] |
Sakura T, Utsunomiya H, Kamakura Y and Taniguchi K 1998 IEEE Int. Electron Devices Meeting Techn. Digest, December 6-9, San Francisco, USA, p. 183
|