[1] Kimoto T and Yonezawa Y 2018 Mater. Sci. Semiconduct. Process. 78 43 [2] Abbate C, Busatto G, Tedesco D, Sanseverino A, Silvestrin L, Velardi F and Wyss J 2019 IEEE Trans. Electron. Devices 66 4235 [3] Hudgins J L, Simin G S, Santi E and Khan M A 2003 IEEE Trans. Power Electron. 18 907 [4] Soo M T, Cheong K Y and Noor A F M 2010 Sens. Actuators B:-Chem. 151 39 [5] Zhang H, Guo H X, Zhang F Q, Pan X Y, Liu Y T, Gu Z Q, Ju A A and Ouyang X P 2022 Chin. Phys. B 31 018501 [6] Soo M T, Cheong K Y and Noor A F M 2010 Sens. Actuators B:-Chem. 151 39 [7] Yang S, Liang X, Cui J, Zheng Q, Sun J, Liu M, Zhang D, Feng H, Yu X, Xiang C, Li Y and Guo Q 2021 J. Semiconduct. 42 082802 [8] Yu Q, Ali W, Cao S, Wang H, Lv H, Sun Y, Mo R, Wang Q, Mei B, Sun J, Zhang H, Tang M, Bai S, Zhang T, Bai Y and Zhang C 2022 IEEE Trans. Nucl. Sci. 69 1127 [9] Emeliyanov V V, Vatuev A S and Useinov R G 2016 IEEE Trans. Nucl. Sci. 63 2176 [10] Zhang T, Allard B and Bi J 2018 Microelectron. Reliab. 88-90 631 [11] Takeyama A, Matsuda T, Yokoseki T, Mitomo S, Murata K, Makino T, Onoda S, Okubo S, Tanaka Y, Kandori M, Yoshie T, Hijikata Y and Ohshima T 2016 Jpn. J. Appl Phys. 55 104101 [12] Zhang C X, Shen X, Zhang E X, Fleetwood D M, Schrimpf R D, Francis S A, Roy T, Dhar S, Ryu S H and Pantelides S T 2013 IEEE Trans. Electron Devices 60 2361 [13] Samanta P and Mandal K C 2017 J. Appl. Phys. 121 034501 [14] Hu D, Zhang J, Jia Y, Wu Y, Peng L and Tang Y 2018 IEEE Trans. Electron. Devices 65 3719 [15] Liang X, Cui J, Zheng Q, Zhao J, Yu X, Sun J, Zhang D and Guo Q 2020 Radiat. Effects Defects Solids 175 559 [16] Muthuseenu K, Barnaby H J, Galloway K F, Koziukov A E, Maksimenko T A, Vyrostkov M Y, Bu-Khasan K B, Kalashnikova A A and Privat A 2021 IEEE Trans. Nucl. Sci. 68 611 [17] Abbate C, Busatto G, Tedesco D, Sanseverino A, Velardi F and Wyss J 2019 IEEE Trans. Electron. Devices 66 4243 [18] Witulski A F, Ball D R, Galloway K F, Javanainen A, Lauenstein J M, Sternberg A L and Schrimpf R D 2018 IEEE Trans. Nucl. Sci. 65 1951 [19] Wang Y, Lin M, Li X J, Wu X, Yang J Q, Bao M T, Yu C H and Cao F 2019 IEEE Trans. Electron Devices 66 4264 [20] Shoji T, Nishida S, Hamada K and Tadano H 2015 Microelectron. Reliab. 55 1517 [21] Titus J L, Wheatley C F, Burton D I, Mouret I, Allenspach M, Brews J, Schrimpf R, Galloway K and Pease R L 1995 IEEE Trans. Nucl. Sci. 42 1928 [22] Li X, Jia Y, Zhou X, Zhao Y, Tang Y, Li Y, Liu G and Jia G 2020 IEEE Electron. Device Lett. 41 216 [23] Scheick L Z and Selva L E 2007 IEEE Trans. Nucl. Sci. 54 2568 [24] Kuboyama S, Mizuta E, Nakada Y and Shindou H 2019 IEEE Trans. Nucl. Sci. 66 1710 [25] Gurimskaya Y, Dias de Almeida P, Fernandez Garcia M, Mateu Suau I, Moll M, Fretwurst E, Makarenko L and Pintilie I 2020 Nucl. Instrum. Methods A 958 162221 [26] Busatto G, De Luca V, Iannuzzo F, Sanseverino A and Velardi F 2013 IEEE Trans. Nucl. Sci. 60 3793 [27] Ikeda N, Kuboyama S, Satoh Y and Tamura T 2008 IEEE Trans. Nucl. Sci. 55 3388 [28] Wan X, Zhou W S, Ren S, Liu D G, Xu J, Bo H L, Zhang E X, Schrimpf R D, Fleetwood D M and Ma T P 2015 IEEE Trans. Nucl. Sci. 62 2830 [29] Ruff M, Mitlehner H and Helbig R 1994 IEEE Trans. Electron. Devices 41 1040 [30] Roschke M and Schwierz F 2001 IEEE Trans. Electron. Devices 48 1442 [31] Koh M, Ohdomari I, Igarashi K, Matsukawa T and Sawara S 1999 J. Appl. Phys. 85 7814 [32] Van Overstraeten R and De Man H 1970 Solid-State Electron. 13 583 [33] Haldar S, Maneesha, Khanna M K and Gupta R S 1994 IEEE Trans. Electron. Devices 41 1674 [34] Shen P, Wang Y and Cao F 2022 Chin. Phys. B 31 078501 [35] DasGupta S, Brock R, Kaplar R, Marinella M, Smith M and Atcitty S 2011 Appl. Phys. Lett. 99 023503 [36] McWhorter P J and Winokur P S 1986 Appl. Phys. Lett. 48 133 [37] Lenahan P M and Dressendorfer P V 1984 J. Appl. Phys. 55 3495 [38] Akturk A, McGarrity J M, Potbhare S and Goldsman N 2012 IEEE Trans. Nucl. Sci. 59 3258 |