中国物理B

• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇    下一篇

Yield strength of attached copper film

张研, 张建民   

  1. College of Physics and Information Technology, Shaanxi Normal University, Xi'an 710062, China
  • 收稿日期:2011-01-08 修回日期:2011-03-29 出版日期:2011-08-15 发布日期:2011-08-15
  • 基金资助:
    Project supported by the State Key Development Program for Basic Research of China (Grant No. 2004CB619302) and the National Natural Science Foundation of China (Grant No. 51071098).

Yield strength of attached copper film

Zhang Yan(张研) and Zhang Jian-Min(张建民)†   

  1. College of Physics and Information Technology, Shaanxi Normal University, Xi'an 710062, China
  • Received:2011-01-08 Revised:2011-03-29 Online:2011-08-15 Published:2011-08-15
  • Supported by:
    Project supported by the State Key Development Program for Basic Research of China (Grant No. 2004CB619302) and the National Natural Science Foundation of China (Grant No. 51071098).

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摘要： Variation of stress in attached copper film with an applied strain is measured by X-ray diffraction combined with a four-point bending method. A lower slope of the initial elastic segment of the curve of X-ray measured stress versus applied strain results from incomplete elastic strain transferred from the substrate to the film due to insufficiently strong interface cohesion. So the slope of the initial elastic segment of the X-ray stress (or X-ray strain directly) of the film against the substrate applied strain may be used to measure the film-substrate cohesive strength. The yield strength of the attached copper film is much higher than that of the bulk material and varies linearly with the inverse of the film thickness.

Abstract: Variation of stress in attached copper film with an applied strain is measured by X-ray diffraction combined with a four-point bending method. A lower slope of the initial elastic segment of the curve of X-ray measured stress versus applied strain results from incomplete elastic strain transferred from the substrate to the film due to insufficiently strong interface cohesion. So the slope of the initial elastic segment of the X-ray stress (or X-ray strain directly) of the film against the substrate applied strain may be used to measure the film-substrate cohesive strength. The yield strength of the attached copper film is much higher than that of the bulk material and varies linearly with the inverse of the film thickness.

Key words: copper film, yield strength, X-ray diffraction

中图分类号:  (Thin film structure and morphology)

  • 68.55.-a
81.40.Lm (Deformation, plasticity, and creep) 68.60.Bs (Mechanical and acoustical properties) 61.05.cp (X-ray diffraction)