中国物理B ›› 2011, Vol. 20 ›› Issue (3): 38102-038102.doi: 10.1088/1674-1056/20/3/038102
S.V Babu1, 刘波2, 宋志棠2, 刘卫丽2, 封松林2, 王良咏3, 黄丕成4
Wang Liang-Yong(王良咏)a)c)†, Liu Bo(刘波) a), Song Zhi-Tang(宋志棠)a), Liu Wei-Li(刘卫丽)a), Feng Song-Lin(封松林)a), David Huang(黄丕成)b), and S.V Babu c)
摘要: We report on the investigation of the origin of high oxide to nitride polishing selectivity of ceria-based slurry in the presence of picolinic acid. The oxide to nitride removal selectivity of the ceria slurry with picolinic acid is as high as 76.6 in the chemical mechanical polishing. By using zeta potential analyzer, particle size analyzer, horizon profilometer, thermogravimetric analysis and Fourier transform infrared spectroscopy, the pre- and the post-polished wafer surfaces as well as the pre- and the post-used ceria-based slurries are compared. Possible mechanism of high oxide to nitride selectivity with using ceria-based slurry with picolinic acid is discussed.
中图分类号: (Polishing, grinding, surface finishing)