Polydisperse spherical colloidal silica particles: Preparation and application

doi:10.1088/1674-1056/25/11/118202

中国物理B ›› 2016, Vol. 25 ›› Issue (11): 118202-118202.doi: 10.1088/1674-1056/25/11/118202

• INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY • 上一篇下一篇

Polydisperse spherical colloidal silica particles: Preparation and application

Hui Kong(孔慧), Junchao Huo(霍军朝), Chenliang Liang(梁晨亮), Shasha Li(李沙沙), Weili Liu(刘卫丽), Zhitang Song(宋志棠)

1 State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China;
2 University of Chinese Academy of Sciences, Beijing 100049, China

收稿日期:2016-03-31 修回日期:2016-08-13 出版日期:2016-11-05 发布日期:2016-11-05
通讯作者: Weili Liu E-mail:rabbitlwl@mail.sim.ac.cn
基金资助:
Project supported by the National Major Scientific and Technological Special Project during the Twelfth Five-year Plan Period of China (Grant No. 2009ZX02030-1), the National Natural Science Foundation of China (Grant No. 51205387), the Science and Technology Commission of Shanghai, China (Grant No. 11nm0500300), and the Science and Technology Commission of Shanghai, China (Grant No. 14XD1425300).

Polydisperse spherical colloidal silica particles: Preparation and application

Hui Kong(孔慧)^1,2, Junchao Huo(霍军朝)¹, Chenliang Liang(梁晨亮)^1,2, Shasha Li(李沙沙)^1,2, Weili Liu(刘卫丽)¹, Zhitang Song(宋志棠)¹

1 State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-system and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China;
2 University of Chinese Academy of Sciences, Beijing 100049, China

Received:2016-03-31 Revised:2016-08-13 Online:2016-11-05 Published:2016-11-05
Contact: Weili Liu E-mail:rabbitlwl@mail.sim.ac.cn
Supported by:
Project supported by the National Major Scientific and Technological Special Project during the Twelfth Five-year Plan Period of China (Grant No. 2009ZX02030-1), the National Natural Science Foundation of China (Grant No. 51205387), the Science and Technology Commission of Shanghai, China (Grant No. 11nm0500300), and the Science and Technology Commission of Shanghai, China (Grant No. 14XD1425300).

摘要/Abstract

摘要： A new industrial method has been developed to produce polydisperse spherical colloidal silica particles with a very broad particle size, ranging from 20-95 nm. The process uses a reactor in which the original seed solution is heated to 100 ° C, and then active silicic acid and the seed solution are titrated to the reactor continuously with a constant rate. The original seeds and the titrated seeds in the reactor will go through different particle growth cycles to form different particle sizes. Both the particles' size distribution and morphology have been characterized by dynamic light scattering (DLS) and the focus ion beam (FIB) system. In addition, the as-prepared polydisperse colloidal silica particle in the application of sapphire wafer's chemical mechanical polishing (CMP) process has been tested. The material removal rate (MRR) of this kind of abrasive has been tested and verified to be much faster than traditional monodisperse silica particles. Finally, the mechanism of sapphire CMP process by this kind of polydisperse silica particles has been investigated to explore the reasons for the high polishing rate.

关键词: colloidal silica, polydisperse, chemical mechanical polishing, sapphire wafer

Abstract: A new industrial method has been developed to produce polydisperse spherical colloidal silica particles with a very broad particle size, ranging from 20-95 nm. The process uses a reactor in which the original seed solution is heated to 100 ° C, and then active silicic acid and the seed solution are titrated to the reactor continuously with a constant rate. The original seeds and the titrated seeds in the reactor will go through different particle growth cycles to form different particle sizes. Both the particles' size distribution and morphology have been characterized by dynamic light scattering (DLS) and the focus ion beam (FIB) system. In addition, the as-prepared polydisperse colloidal silica particle in the application of sapphire wafer's chemical mechanical polishing (CMP) process has been tested. The material removal rate (MRR) of this kind of abrasive has been tested and verified to be much faster than traditional monodisperse silica particles. Finally, the mechanism of sapphire CMP process by this kind of polydisperse silica particles has been investigated to explore the reasons for the high polishing rate.

Key words: colloidal silica, polydisperse, chemical mechanical polishing, sapphire wafer

中图分类号: (Colloids)

82.70.Dd

82.70.Gg (Gels and sols)

孔慧, 霍军朝, 梁晨亮, 李沙沙, 刘卫丽, 宋志棠. Polydisperse spherical colloidal silica particles: Preparation and application[J]. 中国物理B, 2016, 25(11): 118202-118202.

Hui Kong(孔慧), Junchao Huo(霍军朝), Chenliang Liang(梁晨亮), Shasha Li(李沙沙), Weili Liu(刘卫丽), Zhitang Song(宋志棠). Polydisperse spherical colloidal silica particles: Preparation and application[J]. Chin. Phys. B, 2016, 25(11): 118202-118202.

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Polydisperse spherical colloidal silica particles: Preparation and application

Polydisperse spherical colloidal silica particles: Preparation and application

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