Experimental study of surface crystallization on integrated circuit chips

doi:10.1088/1009-1963/15/11/048

中国物理B ›› 2006, Vol. 15 ›› Issue (11): 2746-2750.doi: 10.1088/1009-1963/15/11/048

Experimental study of surface crystallization on integrated circuit chips

王峙卫¹, 张弦², 刘梦新³, 高勇³, 王彩琳³, 张新⁴

(1)East China Institute of Photo-Electron IC, Bengbu 233042, China; (2)East China Institute of Photo-Electron IC, Bengbu233042, China; (3)Xi'an University of Technology, Xi'an710048, China; (4)Xi'an University of Technology, Xi'an710048, China ;East China Institute of Photo-Electron IC, Bengbu 233042, China

收稿日期:2006-01-07 修回日期:2006-05-27 出版日期:2006-11-20 发布日期:2006-11-20

Experimental study of surface crystallization on integrated circuit chips

Zhang Xin(张新)^a)b)†, Liu Meng-Xin(刘梦新)^a), Gao Yong(高勇)^a), Wang Cai-Lin (王彩琳)^a), Wang Zhi-Wei(王峙卫)^b), and Zhang Xian(张弦)^b)

^a Xi'an University of Technology, Xi'an 710048, China; ^b East China Institute of Photo-Electron IC, Bengbu 233042, China

Received:2006-01-07 Revised:2006-05-27 Online:2006-11-20 Published:2006-11-20

摘要/Abstract

摘要： A surface crystallization phenomenon on bonding pads and wires of integrated circuit chip is reported in this paper. Through a lot of experiments, an unknown failure effect caused by mixed crystalline matter is revealed, whereas non-plasma fluorine contamination cannot cause the failure of bonding pads. By experiments combined with infrared spectroscopy analysis, the surface crystallization effect is studied. The conclusion of the study can provide the guidance for IC fabrication, modelling and analysis.

关键词: infrared spectrum technology, bonding pad, crystallization, failure

Abstract: A surface crystallization phenomenon on bonding pads and wires of integrated circuit chip is reported in this paper. Through a lot of experiments, an unknown failure effect caused by mixed crystalline matter is revealed, whereas non-plasma fluorine contamination cannot cause the failure of bonding pads. By experiments combined with infrared spectroscopy analysis, the surface crystallization effect is studied. The conclusion of the study can provide the guidance for IC fabrication, modelling and analysis.

Key words: infrared spectrum technology, bonding pad, crystallization, failure

中图分类号: (Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology)

85.40.-e

78.30.-j (Infrared and Raman spectra)

张新, 刘梦新, 高勇, 王彩琳, 王峙卫, 张弦. Experimental study of surface crystallization on integrated circuit chips[J]. 中国物理B, 2006, 15(11): 2746-2750.

Zhang Xin(张新), Liu Meng-Xin(刘梦新), Gao Yong(高勇), Wang Cai-Lin (王彩琳), Wang Zhi-Wei(王峙卫), and Zhang Xian(张弦). Experimental study of surface crystallization on integrated circuit chips[J]. Chinese Physics, 2006, 15(11): 2746-2750.

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Experimental study of surface crystallization on integrated circuit chips

Experimental study of surface crystallization on integrated circuit chips

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