中国物理B ›› 2006, Vol. 15 ›› Issue (11): 2751-2755.doi: 10.1088/1009-1963/15/11/049
陈文新1, 卜伟海2, 黄如2, 黎明2, 田豫2, 吴大可2, 王阳元2
Bu Wei-Hai(卜伟海)a), Huang Ru(黄如)a)†, Li Ming(黎明)a), Tian Yu(田豫)a), Wu Da-Ke(吴大可)a), Chan Man-Sun(陈文新)b), and Wang Yang-Yuan(王阳元)a)
摘要: In this paper, a method to fabricate Silicon-on-Nothing (SON) MOSFETs using H$^{ + }$ and He$^{ + }$ co-implantation is presented. The technique is compatible with conventional CMOS technology and its feasibility has been experimentally demonstrated. SON MOSFETs with 50nm gate length have been fabricated. Compared with the corresponding bulk MOSFETs, the SON MOSFETs show higher on current, reduced leakage current and lower subthreshold slope.
中图分类号: (Field effect devices)