A novel method for sacrificial layer release in MEMS devices fabrication

doi:10.1088/1674-1056/19/7/076802

中国物理B ›› 2010, Vol. 19 ›› Issue (7): 76802-076802.doi: 10.1088/1674-1056/19/7/076802

A novel method for sacrificial layer release in MEMS devices fabrication

石莎莉, 陈大鹏, 景玉鹏, 欧毅, 叶甜春, 徐秋霞

Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

收稿日期:2009-03-04 修回日期:2010-01-12 出版日期:2010-07-15 发布日期:2010-07-15

A novel method for sacrificial layer release in MEMS devices fabrication

Shi Sha-Li (石莎莉), Chen Da-Peng (陈大鹏), Jing Yu-Peng (景玉鹏), Ou Yi (欧毅), Ye Tian-Chun (叶甜春), Xu Qiu-Xia (徐秋霞)

Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

Received:2009-03-04 Revised:2010-01-12 Online:2010-07-15 Published:2010-07-15

摘要/Abstract

摘要： During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a novel `dimpled' method in releasing sacrificial layer. Based on the conception of pull-in length in adhering phenomenon, the fabrication and releasing sacrificial layer methods using micro bumps based on the silicon substrate were presented. According to the thermal isolation performances of one kind of micro electromechanical system device thermal shear stress sensor, the sacrificial layers were validated to be successfully released.

Abstract: During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a novel `dimpled' method in releasing sacrificial layer. Based on the conception of pull-in length in adhering phenomenon, the fabrication and releasing sacrificial layer methods using micro bumps based on the silicon substrate were presented. According to the thermal isolation performances of one kind of micro electromechanical system device thermal shear stress sensor, the sacrificial layers were validated to be successfully released.

Key words: sacrificial layer, adhering, pull in length, bump

中图分类号: (Micro- and nano-electromechanical systems (MEMS/NEMS) and devices)

85.85.+j

81.65.Ps (Polishing, grinding, surface finishing) 07.10.Cm (Micromechanical devices and systems)

石莎莉, 陈大鹏, 景玉鹏, 欧毅, 叶甜春, 徐秋霞. A novel method for sacrificial layer release in MEMS devices fabrication[J]. 中国物理B, 2010, 19(7): 76802-076802.

Shi Sha-Li (石莎莉), Chen Da-Peng (陈大鹏), Jing Yu-Peng (景玉鹏), Ou Yi (欧毅), Ye Tian-Chun (叶甜春), Xu Qiu-Xia (徐秋霞). A novel method for sacrificial layer release in MEMS devices fabrication[J]. Chin. Phys. B, 2010, 19(7): 76802-076802.

参考文献 27

[1]	Cui Z and Lawes R A 1997wxJ. Micromech. Microeng.7 128
[2]	Bartek M and Wolffenbuttel R F 1998 wxJ. Micromech. Microeng.8 91
[3]	Bagolini A, Pakula L, Scholtes T L M, Pham H T M, French P J and Sarro P M 2002 wxJ. Micromech. Microeng.12 385
[4]	Teh W H, Liang C T, Mark G and Smith Ch. G 2003 wxJ. Microelectromech. S bf12 641
[5]	Suh H J, Bharathi P, Beebe D J and Moore J S 2000 wxJ. Microelectromech. S bf9 198
[6]	Frederico S, Hibert C, Fritschi R, Fluckiger Ph, Renaud Ph and Ionescu A M 2003 wxProc. 16th IEEE Int. Conf. on Micro Mechanical Systems (MEMS' 03) Kyoto, Japan, Jan. 2003 p570
[7]	Stahl H, Hoechst A, Fischer F, Metzger L, Reichenbach R, Laermer F, Kronmueller S, Breitschwerdt K, Gunn R, Watcham S, Rusu C and Witvrouw A 2003 wxThe 12th Iinternational Conference on Solid State Sensors, Actuators and Microsystems Boston USA, June 2003
[8]	Kim B H, Chung T D, Oh C H and Chun K 2001 wxJ. Microelectromech. S bf10 33
[9]	Srinivasan U, Houston M R, Howe R T and Maboudian R 1998 wxJ. Microelectromech. S bf7 252
[10]	Lee Y I, Park K H, Lee J, Lee C S, Yoo H J, Kim C J and Yoon Y S 1997 wxJ. Microelectromech. S bf6 226
[11]	Kim J Y and Kim C J 1997 wxProc. Tenth Annual IEEE Int. Workshop Micro Electro Mechanical Systems MEMS' 97 Nagoya, Japan, Jan. 1997 p442
[12]	Fan L S 1990 Integrated Micromachinery----Moving Structures on Silicon Chips Ph.D. Dissertation, University of California, Berkeley USA
[13]	David A K, Ramaswammy M, Alex S and Karen W M 1996 Smart MUMPs Design Handbook Including MUMPs Introduction and Design Rules (rev. 4) (MCNC)
[14]	Solgaard O, Daneman M, Tien N C, Friedberger A, Muller R S and Lau K Y 1995 wxIEEE Photonic Tech. L7
[15]	Chan E K L 1999 Characterization and Modeling of Electrostatically Actuated Polysilicon Micromechanical Devices Ph.D. Dissertation, Stanford University, USA
[16]	Warren M E 1998 wxIEEE/LEOS Summer Topical Meetings Monterey CA, July 1998
[17]	Michalicek M A, Corntois J H and Barron C C 1997 wxProceedings of the Second Annual IEEE International Conference on Innovative Systems in Silicon p144
[18]	Kim C J, Kim J Y and Sridharan B 1998 wxSensor Actuat A64 17
[19]	Mastrangelo C H and Hsu C H 1993 wxJ. Microelectromech. S bf2 33
[20]	Mastrangelo C H and Hsu C H 1993 wxJ. Microelectromech. S bf2 44
[21]	Rob L, Harrie A C T, Job E and Miko E 1994 wxSensor Actuat. A43 230
[22]	Liu C, Huang J B, Zhu Z J, Jiang F K, Tung S, Tai Y C and Ho C M 1999 wxJ. Microelectromech. S8
[23]	Shi S L, Yi L, Chen D P, Ou Y, Jing Y P, Ye T C and Cheng Z Y 2008 wxJ. Micro/Nanolithography, MEMS, and MOEMS(JM3)7
[24]	Yi L, Ou Y, Shi S L, Ma J, Chen D P and Ye T C 2008 wxChin. Phys. B17 2130
[25]	Ou Y, Cui F and Sun Y 2003 wxActa Photonica Sinica32 1110
[26]	Shi S L, Jiao B B, Chen D P, Li C B, Ding D Y, Ou Y, Ye T C, Duan Z H, Wu X P and Zhang Q C 2007 wxSensor Actuat. A133 64
[27]	Xiong Z M, Zhang Q C, Chen D P, Wu X P, Guo Z Y, Dong F L, Miao Z Y and Li C B 2007 wxActa Phys. Sin.56 2529 (in Chinese)

A novel method for sacrificial layer release in MEMS devices fabrication

A novel method for sacrificial layer release in MEMS devices fabrication

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