中国物理B ›› 2010, Vol. 19 ›› Issue (12): 127304-127304.doi: 10.1088/1674-1056/19/12/127304

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Performance comparison of Pt/Au and Ni/Au Schottky contacts on AlxGa1-x N/GaN heterostructures at high temperatures

刘新宇1, 魏珂1, 黄俊1, 林芳2, 沈波2, 卢励吾2, 马楠2, 许福军2, 苗振林2, 宋杰2   

  1. (1)Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China; (2)State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China
  • 收稿日期:2010-06-18 修回日期:2010-06-29 出版日期:2010-12-15 发布日期:2010-12-15
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant Nos. 60906041, 10774001, 60736033, and 60890193) and the National Basic Research Program of China (Grant Nos. 2006CB604908 and 2006CB921607).

Performance comparison of Pt/Au and Ni/Au Schottky contacts on AlxGa1-x N/GaN heterostructures at high temperatures

Lin Fang(林芳)a), Shen Bo(沈波)a),Lu Li-Wu(卢励吾)a), Ma Nan(马楠)a), Xu Fu-Jun(许福军)a), Miao Zhen-Lin(苗振林)a), Song Jie(宋杰)a), Liu Xin-Yu(刘新宇)b), Wei Ke(魏珂)b), and Huang Jun(黄俊)b)   

  1. a State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China; b Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
  • Received:2010-06-18 Revised:2010-06-29 Online:2010-12-15 Published:2010-12-15
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant Nos. 60906041, 10774001, 60736033, and 60890193) and the National Basic Research Program of China (Grant Nos. 2006CB604908 and 2006CB921607).

摘要: In contrast with Au/Ni/Al0.25Ga0.75N/GaN Schottky contacts, this paper systematically investigates the effect of thermal annealing of Au/Pt/Al0.25Ga0.75N/GaN structures on electrical properties of the two-dimensional electron gas in Al0.25Ga0.75N/GaN heterostructures by means of temperature-dependent Hall and temperature-dependent current–voltage measurements. The two-dimensional electron gas density of the samples with Pt cap layer increases after annealing in N2 ambience at 600 du while the annealing treatment has little effect on the two-dimensional electron gas mobility in comparison with the samples with Ni cap layer. The experimental results indicate that the Au/Pt/Al0.25Ga0.75N/GaN Schottky contacts reduce the reverse leakage current density at high annealing temperatures of 400–600 du. As a conclusion, the better thermal stability of the Au/Pt/Al0.25Ga0.75N/GaN Schottky contacts than the Au/Ni/Al0.25Ga0.75N/GaN Schottky contacts at high temperatures can be attributed to the inertness of the interface between Pt and AlxGa1-xN.

Abstract: In contrast with Au/Ni/Al0.25Ga0.75N/GaN Schottky contacts, this paper systematically investigates the effect of thermal annealing of Au/Pt/Al0.25Ga0.75N/GaN structures on electrical properties of the two-dimensional electron gas in Al0.25Ga0.75N/GaN heterostructures by means of temperature-dependent Hall and temperature-dependent current–voltage measurements. The two-dimensional electron gas density of the samples with Pt cap layer increases after annealing in N2 ambience at 600 $^\circ$C while the annealing treatment has little effect on the two-dimensional electron gas mobility in comparison with the samples with Ni cap layer. The experimental results indicate that the Au/Pt/Al0.25Ga0.75N/GaN Schottky contacts reduce the reverse leakage current density at high annealing temperatures of 400–600 $^\circ$C. As a conclusion, the better thermal stability of the Au/Pt/Al0.25Ga0.75N/GaN Schottky contacts than the Au/Ni/Al0.25Ga0.75N/GaN Schottky contacts at high temperatures can be attributed to the inertness of the interface between Pt and AlxGa1-xN.

Key words: gate leakage current, high temperature, Frenkel–Poole emission

中图分类号:  (Surface double layers, Schottky barriers, and work functions)

  • 73.30.+y
73.40.Kp (III-V semiconductor-to-semiconductor contacts, p-n junctions, and heterojunctions) 81.40.Ef (Cold working, work hardening; annealing, post-deformation annealing, quenching, tempering recovery, and crystallization)