中国物理B ›› 2007, Vol. 16 ›› Issue (2): 529-532.doi: 10.1088/1009-1963/16/2/040

• • 上一篇    下一篇

Electrical properties and reliability of HfO2 gate-dielectric MOS capacitors with trichloroethylene surface pretreatment

黎沛涛1, 陈铸略1, 徐静平2, 陈卫兵3, 李艳萍3   

  1. (1)Department of Electrical and Electronic Engineering, the University of Hong Kong, Pokfulam Road, Hong Kong, China ; (2)Department of Electronic Science & Technology, Huazhong University of Science and Technology, Wuhan 430074, China; (3)Department of Electronic Science \& Technology, Huazhong University of Science and Technology, Wuhan 430074, China
  • 收稿日期:2006-06-06 修回日期:2006-08-23 出版日期:2007-02-20 发布日期:2007-02-20
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant No 60376019).

Electrical properties and reliability of HfO2 gate-dielectric MOS capacitors with trichloroethylene surface pretreatment

Xu Jing-Ping(徐静平)a), Chen Wei-Bing(陈卫兵)a), Lai Pui-To(黎沛涛)b), Li Yan-Ping(李艳萍)a), and Chan Chu-Lok(陈铸略)b)   

  1. a Department of Electronic Science & Technology, Huazhong University of Science and Technology, Wuhan 430074, China; b Department of Electrical and Electronic Engineering, the University of Hong Kong, Pokfulam Road, Hong Kong, China 
  • Received:2006-06-06 Revised:2006-08-23 Online:2007-02-20 Published:2007-02-20
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant No 60376019).

摘要: Trichloroethylene (TCE) pretreatment of Si surface prior to HfO2 deposition is employed to fabricate HfO2 gate-dielectric MOS capacitors. Influence of this processing procedure on interlayer growth, HfO2/Si interface properties, gate-oxide leakage and device reliability is investigated. Among the surface pretreatments in NH3, NO, N2O and TCE ambients, the TCE pretreatment gives the least interlayer growth, the lowest interface-state density, the smallest gate leakage and the highest reliability. All these improvements should be ascribed to the passivation effects of Cl2 and HCl on the structural defects in the interlayer and at the interface, and also their gettering effects on the ion contamination in the gate dielectric.

关键词: MOS capacitors, high-k gate dielectric, HfO2, interlayer, surface treatment

Abstract: Trichloroethylene (TCE) pretreatment of Si surface prior to HfO2 deposition is employed to fabricate HfO2 gate-dielectric MOS capacitors. Influence of this processing procedure on interlayer growth, HfO2/Si interface properties, gate-oxide leakage and device reliability is investigated. Among the surface pretreatments in NH3, NO, N2O and TCE ambients, the TCE pretreatment gives the least interlayer growth, the lowest interface-state density, the smallest gate leakage and the highest reliability. All these improvements should be ascribed to the passivation effects of Cl2 and HCl on the structural defects in the interlayer and at the interface, and also their gettering effects on the ion contamination in the gate dielectric.

Key words: MOS capacitors, high-k gate dielectric, HfO2, interlayer, surface treatment

中图分类号:  (Field effect devices)

  • 85.30.Tv
68.47.Fg (Semiconductor surfaces) 81.65.Rv (Passivation) 81.65.Tx (Gettering) 84.32.Tt (Capacitors) 85.30.De (Semiconductor-device characterization, design, and modeling)