中国物理B ›› 2007, Vol. 16 ›› Issue (2): 529-532.doi: 10.1088/1009-1963/16/2/040
黎沛涛1, 陈铸略1, 徐静平2, 陈卫兵3, 李艳萍3
Xu Jing-Ping(徐静平)a)†, Chen Wei-Bing(陈卫兵)a), Lai Pui-To(黎沛涛)b), Li Yan-Ping(李艳萍)a), and Chan Chu-Lok(陈铸略)b)
摘要: Trichloroethylene (TCE) pretreatment of Si surface prior to HfO2 deposition is employed to fabricate HfO2 gate-dielectric MOS capacitors. Influence of this processing procedure on interlayer growth, HfO2/Si interface properties, gate-oxide leakage and device reliability is investigated. Among the surface pretreatments in NH3, NO, N2O and TCE ambients, the TCE pretreatment gives the least interlayer growth, the lowest interface-state density, the smallest gate leakage and the highest reliability. All these improvements should be ascribed to the passivation effects of Cl2 and HCl on the structural defects in the interlayer and at the interface, and also their gettering effects on the ion contamination in the gate dielectric.
中图分类号: (Field effect devices)