中国物理B ›› 2011, Vol. 20 ›› Issue (3): 37305-037305.doi: 10.1088/1674-1056/20/3/037305
郝跃1, 张月1, 曹艳荣2, 马晓华3
Ma Xiao-Hua(马晓华)a)†,Cao Yan-Rong(曹艳荣)b),Hao Yue(郝跃)c),and Zhang Yue(张月)c)
摘要: In this paper, we have studied hot carrier injection (HCI) under alternant stress. Under different stress modes, different degradations are obtained from the experiment results. The different alternate stresses can reduce or enhance the HC effect, which mainly depends on the latter condition of the stress cycle. In the stress mode A (DC stress with electron injection), the degradation keeps increasing. In the stress modes B (DC stress and then stress with the smallest gate injection) and C (DC stress and then stress with hole injection under Vg=0 V and Vg=1.8 V), recovery appears in the second stress period. And in the stress mode D (DC stress and then stress with hole injection under Vg=-1.8 V and Vd=1.8 V), as the traps filled in by holes can be smaller or greater than the generated interface states, the continued degradation or recovery in different stress periods can be obtained.
中图分类号: (Metal-insulator-semiconductor structures (including semiconductor-to-insulator))