[1] |
Li H, Dimitrijev S, Harrison H B and Sweatman D 1997 Appl. Phys. Lett. 70 2028
|
[2] |
McDonald K, Weller R A, Pantelides S T, Feldman L C, Chung G Y, Tin C C and Williams J R 2003 J. Appl. Phys. 93 2719
|
[3] |
Dhar S, Song Y W, Feldman L C, Isaacs-Smith T, Tin C C, Williams J R, Chung G, Nishimura T, Starodub D, Gustafson T and Garfunkel E 2004 Appl. Phys. Lett. 84 1498
|
[4] |
Lu C Y, Cooper J A, Tsuji T, Chung G, Wiliams J R, McDonald K and Feldman L C 2003 IEEE Trans. Electron Dev. 50 1582
|
[5] |
Chung G Y, Tin C C, Wiliams J R, McDonald K, Chanana R K, Weller R A, Pantelides S T, Feldman L C, Holland O W, Das M K and Palmour J W 2001 IEEE Electron Dev. Lett. 22 176
|
[6] |
Rozen J, Ahyi A C, Zhu X G, Williams J R and Feldman L C 2011 IEEE Trans. Electron Dev. 58 3808
|
[7] |
Fujihira K, Tarui Y, Imaizumi M, Ohtsuka K, Takami T, Shiramizu T, Kawase K, Tanimura J and Ozeki T 2005 Solid-State Electron. 49 896
|
[8] |
Yoshioka H, Nakamura T and Kimoto T 2014 J. Appl. Phys. 115 014502
|
[9] |
Noborio M, Grieb M, Bauer A J, Peters D, Friedrichs P, Suda J and Kimoto T 2011 Jpn. J. Appl. Phys. 50 090201
|
[10] |
Matocha K, Dunne G, Soloviev S and Beaupre R 2008 IEEE Trans. Electron Dev. 55 1830
|
[11] |
Lazar H R, Misra V, Johnson R S and Lucovsky G 2001 Appl. Phys. Lett. 79 973
|
[12] |
Groner M D, Elam J W, Fabreguett H H and George S M 2002 Thin Solid Films 413 186
|
[13] |
Gao K Y, Seyller T, Ley L, Ciobanu F, Pensl G, Tadich A, Riley J D and Leckey R G C 2003 Appl. Phys. Lett. 83 1830
|
[14] |
Tanner C M, Perng Y C, Frewin C, Saddow S E and Chang J P 2007 Appl. Phys. Lett. 91 203510
|
[15] |
Avice M, Grossner U, Pintilie I, Svensson B G, Servidori M, Nipoti R, Nilsen O and Fjellvag H 2007 J. Appl. Phys. 102 054513
|
[16] |
Hino S, Hatayama T, Miura N, Oomori T and Tokumitsu E 2007 Mater. Sci. Forum 556 787
|
[17] |
Moriya H, Hino S, Miura N, Oomori T and Tokumitsu E 2009 Mater. Sci. Forum 615 777
|
[18] |
Hino S, Hatayama T, Kato J, Tokumitsu E, Miura N and Oomori T 2008 Appl. Phys. Lett. 92 183503
|
[19] |
Cheong K Y, Moon J H, Eom D, Kim H J, Bahng W and Kim N K 2007 Electrochem. Solid ST 10 H69
|
[20] |
Avice M, Diplas S, Thogersen A, Christensen J S, Grossner U, Svensson B G, Nilsen O, Fjellvag H and Watts J F 2007 Appl. Phys. Lett. 91 052907
|
[21] |
Wang Y Y, Shen H J, Bai Y, Tang Y D, Liu K A, Li C Z and Liu X Y 2013 Chin. Phys. B 22 078102
|
[22] |
Kim E J, Wang L, Asbeck P M, Saraswat K C and Mclntyre P C 2010 Appl. Phys. Lett. 96 012906
|
[23] |
Hu J and Philip Wong H S 2012 J. Appl. Phys. 111 044105
|
[24] |
Lichtenwalner D J, Misra V, Dhar S, Ryu S and Agarwal A 2009 Appl. Phys. Lett. 95 152113
|
[25] |
Hatayama T, Hino S, Miura N, Oomori T and Tokumitsu E 2008 IEEE Trans. Electron Dev. 55 2041
|
[26] |
Hosoi T, Harada M, Kagei Y, Watanabe Y, Shimura T, Mitani S, Nakano Y, Nakamura T and Watanabe H 2009 Mater. Sci. Forum 615 541
|
[27] |
Avice M, Grossner U, Pintilie I, Svensson B G, Nilsen O and Fjellvag H 2006 Appl. Phys. Lett. 89 222103
|
[28] |
Hosoi T, Kagei Y, Kirino T, Mitani S, Nakano Y, Nakmura T, Shimura T and Watanabe H 2011 Mater. Sci. Forum 679 496
|
[29] |
Nicollian E H and Brews J R 2003 MOS Physics and Technology (Hoboken: Wiley) pp. 212–226 and 325–328
|
[30] |
Lin J, Gomeniuk Y Y, Monaghan S, Povey I M, Cherkaoui K, Connor E O, Power M and Hurley P K 2013 J. Appl. Phys. 114 144105
|
[31] |
Schroder D K 2006 Semiconductor Material and Device Characterization, 3rd edn. (Hoboken: Wiley) pp. 71–75
|
[32] |
Xu M, Xu C H, Ding S J, Lu H L, Zhang D W and Wang L K 2006 J. Appl. Phys. 99 074109
|
[33] |
Kerber A, Cartier E, Degraeve R, Pantisano L, Roussel P and Groeseneken G 2002 Symposium on VLSI Dig., June 11–13, 2002, Honolulu, USA, p. 76
|
[34] |
Puurunen R L and Vandervorst W 2004 J. Appl. Phys. 96 4878
|
[35] |
Frank M M, Chabal Y J and Wilk G D 2003 Appl. Phys. Lett. 82 4758
|
[36] |
Klejna S and Elliot S D 2012 J. Phys. Chem. C 116 643
|