中国物理B ›› 2022, Vol. 31 ›› Issue (8): 88101-088101.doi: 10.1088/1674-1056/ac673e
Tianyuan Song(宋天源)1, Dongli Zhang(张冬利)1,†, Mingxiang Wang(王明湘)1, and Qi Shan(单奇)2
Tianyuan Song(宋天源)1, Dongli Zhang(张冬利)1,†, Mingxiang Wang(王明湘)1, and Qi Shan(单奇)2
摘要: Degradation of a-InGaZnO thin-film transistors working under simultaneous DC gate and drain bias stress is investigated, and the corresponding degradation mechanism is proposed and verified. The maximum degradation occurs under the bias stress condition that makes the electric field and electron concentration relatively high at the same time. Trapping of hot electrons in the etching-stop layer under the extended drain electrode is proven to be the underlying mechanism. The observed degradation phenomena, including distortion in the transfer curve on a logarithmic scale and two-slope dependence on gate bias on a linear scale, current crowding in the output curve, and smaller degradation in transfer curves measured under large drain bias, can all be well explained with the proposed degradation mechanism.
中图分类号: (Amorphous semiconductors)