中国物理B ›› 2017, Vol. 26 ›› Issue (11): 118104-118104.doi: 10.1088/1674-1056/26/11/118104
• INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY • 上一篇 下一篇
Yuan Li(李源), Hongwei Yan(严鸿维), Ke Yang(杨科), Caizhen Yao(姚彩珍), Zhiqiang Wang(王志强), Chunyan Yan(闫春燕), Xinshu Zou(邹鑫书), Xiaodong Yuan(袁晓东), Liming Yang(杨李茗), Xin Ju(巨新)
Yuan Li(李源)1,2, Hongwei Yan(严鸿维)2, Ke Yang(杨科)2, Caizhen Yao(姚彩珍)2, Zhiqiang Wang(王志强)2, Chunyan Yan(闫春燕)1, Xinshu Zou(邹鑫书)2, Xiaodong Yuan(袁晓东)2, Liming Yang(杨李茗)3, Xin Ju(巨新)1
摘要:
Polished fused silica samples were etched for different durations by using hydrofluoric (HF) acid solution with HF concentrations in an ultrasonic field. Surface and subsurface polishing residues and molecular structure parameters before and after the etching process were characterized by using a fluorescence microscope and infrared (IR) spectrometer, respectively. The laser induced damage thresholds (LIDTs) of the samples were measured by using pulsed nanosecond laser with wavelength of 355 nm. The results showed that surface and subsurface polishing residues can be effectively reduced by the acid etching process, and the LIDTs of fused silica are significantly improved. The etching effects increased with the increase of the HF concentration from 5 wt.% to 40 wt.%. The amount of polishing residues decreased with the increase of the etching duration and then kept stable. Simultaneously, with the increase of the etching time, the mechanical strength and molecular structure were improved.
中图分类号: (Surface cleaning, etching, patterning)