中国物理B ›› 2022, Vol. 31 ›› Issue (1): 18501-018501.doi: 10.1088/1674-1056/ac051d
Sensitivity of heavy-ion-induced single event burnout in SiC MOSFET
Hong Zhang(张鸿)1, Hong-Xia Guo(郭红霞)1,2,†, Feng-Qi Zhang(张凤祁)2, Xiao-Yu Pan(潘霄宇)2, Yi-Tian Liu(柳奕天)1, Zhao-Qiao Gu(顾朝桥)1, An-An Ju(琚安安)1, and Xiao-Ping Ouyang(欧阳晓平)2
- 1 School of Material Science and Engineering, Xiangtan University, Xiangtan 411105, China;
2 Northwest Institute of Nuclear Technology, Xi'an 710024, China
Sensitivity of heavy-ion-induced single event burnout in SiC MOSFET
Hong Zhang(张鸿)1, Hong-Xia Guo(郭红霞)1,2,†, Feng-Qi Zhang(张凤祁)2, Xiao-Yu Pan(潘霄宇)2, Yi-Tian Liu(柳奕天)1, Zhao-Qiao Gu(顾朝桥)1, An-An Ju(琚安安)1, and Xiao-Ping Ouyang(欧阳晓平)2
- 1 School of Material Science and Engineering, Xiangtan University, Xiangtan 411105, China;
2 Northwest Institute of Nuclear Technology, Xi'an 710024, China
摘要： The energy deposition and electrothermal behavior of SiC metal-oxide-semiconductor field-effect transistor (MOSFET) under heavy ion radiation are investigated based on Monte Carlo method and TCAD numerical simulation. The Monte Carlo simulation results show that the density of heavy ion-induced energy deposition is the largest in the center of the heavy ion track. The time for energy deposition in SiC is on the order of picoseconds. The TCAD is used to simulate the single event burnout (SEB) sensitivity of SiC MOSFET at four representative incident positions and four incident depths. When heavy ions strike vertically from SiC MOSFET source electrode, the SiC MOSFET has the shortest SEB time and the lowest SEB voltage with respect to direct strike from the epitaxial layer, strike from the channel, and strike from the body diode region. High current and strong electric field simultaneously appear in the local area of SiC MOSFET, resulting in excessive power dissipation, further leading to excessive high lattice temperature. The gate-source junction area and the substrate-epitaxial layer junction area are both the regions where the SiC lattice temperature first reaches the SEB critical temperature. In the SEB simulation of SiC MOSFET at different incident depths, when the incident depth does not exceed the device's epitaxial layer, the heavy-ion-induced charge deposition is not enough to make lattice temperature reach the SEB critical temperature.
中图分类号: (Field effect devices)
- 85.30.Tv