[1] Chen H Y, Zhou X F, Tang L, Chen Y H, Luo H, Yuan X, Bowen C R and Zhang D 2022 Appl. Phys. Rev. 9 011307 [2] Ali F, Ali T, Lehninger D, Sünbül A, Viegas A, Sachdeva R, Abbas A, Czernohorsky M and Seidel K 2022 Adv. Funct. Mater. 32 2201737 [3] Zhao D, Chen Z B and Liao X Z 2022 Microstructures 2 2022007 [4] Migita S, Ota H, Shibuya K, Yamada H, Sawa A, Matsukawa T and Toriumi A 2019 Jpn. J. Appl. Phys. 58 SBBA07 [5] Park M H, Lee Y H, Kim H J, Kim Y J, Moon T, Kim K D, Müller J, Kersch A, Schroeder U, Mikolajick T and Hwang C S 2015 Adv. Mater. 27 1811 [6] Kim S J, Mohan J, Summerfelt S R and Kim J 2018 JOM 71 246 [7] Park M H, Lee D H, Yang K, Park J Y, Yu G T, Park H W, Materano M, Mittmann T, Lomenzo P D, Mikolajick T, Schroeder U and Hwang C S 2020 J. Mater. Chem. C 8 10526 [8] Kim H J, An Y, Jung Y C, Mohan J, Yoo J G, Kim Y I, Hernandez-Arriaga H, Kim H S, Kim J and Kim S J 2021 Phys. Status. Solidi. RRL 15 2100028 [9] Park M H, Lee Y H, Kim H J, Kim Y J, Moon T, Kim K D, Hyun S D, Mikolajick T, Schroeder U and Hwang C S 2018 Nanoscale 10 716 [10] Lin Y C, McGuire F and Franklin A D 2018 J. Vac. Sci. Technol. B 36 011204 [11] Mittmann T, Fengler F P G, Richter C, Park M H, Mikolajick T and Schroeder U 2017 Microelectron. Eng. 178 48 [12] Park M H, Kim H J, Kim Y J, Lee W, Moon T and Hwang C S 2013 Appl. Phys. Lett. 102 242905 [13] Yoon J S, Tewari A, Shin C and Jeon S 2019 IEEE Electron. Device Lett. 40 1076 [14] Lee Y, Hsain H A, Fields S S, Jaszewski S T, Horgan M D, Edgington P G, Ihlefeld J F, Parsons G N and Jones J L 2021 Appl. Phys. Lett. 118 012903 [15] Kim S J, Mohan J, Lee J, Lee J S, Lucero A T, Young C D, Colombo L, Summerfelt S R, San T and Kim J 2018 Appl. Phys. Lett. 112 172902 [16] Onaya T, Nabatame T, Sawamoto N, Ohi A, Ikeda N, Nagata T and Ogura A 2019 Microelectron. Eng. 215 111013 [17] Li Y X, Liang R R, Wang J B, Zhang Y, Tian H, Liu H F, Li S L, Mao W Q, Pang Y, Li Y T, Yang Y and Ren T L 2017 IEEE J. Electron. Devices. Soc. 5 378 [18] Kim S J, Narayan D, Lee J, Mohan J, Lee J S, Lee J, Kim H S, Byun Y C, Lucero A T, Young C D, Summerfelt S R, San T, Colombo L and Kim J 2017 Appl. Phys. Lett. 111 242901 [19] Gaddam V, Das D, Jung T and Jeon S 2021 IEEE Electron. Device Lett. 42 812 [20] Persson A E O, Athle R, Littow P, Persson K M, Svensson J, Borg M and Wernersson L E 2020 Appl. Phys. Lett. 116 062902 [21] Toprasertpong K, Tahara K, Fukui T, Lin Z Y, Watanabe K, Takenaka M and Takagi S 2020 IEEE Electron. Device Lett. 41 1588 [22] Goh Y, Hwang J, Lee Y, Kim M and Jeon S 2020 Appl. Phys. Lett. 117 242901 [23] Wang D, Zhang Y, Wang J L, Luo C L, Li M, Shuai W T, Tao R Q, Fan Z, Chen D Y, Zeng M, Dai J Y, Lu X B and Liu J M 2022 J. Mater. Sci. Technol. 104 1 [24] Kashir A, Kim H, Oh S and Hwang H 2021 ACS. Appl. Electron. Mater. 3 629 [25] Shiraishi T, Katayama K, Yokouchi T, Shimizuc T, Oikawa T, Sakata O, Uchida H, Imaie Y, Kiguchi T, Konno T J and Funakubo H 2017 Mater. Sci. Semicond. Proc. 70 239 [26] Kashir A, Kim H, Oh S and Hwang H 2021 ACS Appl. Electron. Mater. 3 629 [27] Kim H, Kashir A, Oh S and Hwang H 2021 Nanotechnology 32 055703 [28] Park M H, Lee Y H, Mikolajick T, Schroeder U and Hwang C S 2019 Adv. Electron. Mater. 5 1800522 [29] Oh S, Kim H, Kashir A and Hwang H 2020 Appl. Phys. Lett. 117 252906 [30] Chernikova A G, Kuzmichev D S, Negrov D V, Kozodaev M G, Polyakov S N and Markeev A M 2016 Appl. Phys. Lett. 108 242905 [31] Mueller S, Muller J, Schroeder U and Mikolajick T 2013 IEEE Trans. Device. Mater. Reliab. 13 93 [32] Mueller S, Mueller J, Singh A, Riedel S, Sundqvist J, Schroeder U and Mikolajick T 2012 Adv. Funct. Mater. 22 2412 [33] Yau H M, Chen X X, Wong C M, Chen D Y and Dai J Y 2021 Mater. Charact. 176 111114 [34] Wang J J, Zhou D Y, Dong W, Yao Y F, Sun N, Ali F Z, Hou X D and Liu F 2021 Adv. Electron. Mater. 7 2000585 [35] Yang C, Fan H Q, Qiu S J, Xi Y X and Fu Y F 2009 J. Non-Cryst. Solids. 355 33 [36] Onaya T, Nabatame T, Sawada T, Kurishima K, Sawamoto N, Ohi A, Chikyow T and Ogura A 2016 ECS Trans. 75 667 [37] Onaya T, Nabatame T, Sawada T, Kurishima K and Sawamoto N 2018 Thin. Solid. Films. 655 48 [38] Martin D, Grube M, Weinreich W, Müller J, Weber W M, Schröder U, Riechert H and Mikolajick T 2013 J. Appl. Phys. 113 194103 [39] Niinistö J, Kukli K, Heikkilä M, Ritala M and Leskelä M 2019 Adv. Eng. Mater. 11 223 [40] Zheng Q S, Liu Y C, Li M, Liu Z G, Hu Y H, Zhang X W, Deng W and Wang M T 2020 J. Eur. Ceram. Soc. 40 463 [41] Chen K T, Chen H Y, Liao C Y, Siang G Y, Lo C, Liao M H, Li K S, Chang S T and Lee M H 2019 IEEE Electron. Device Lett. 40 399 [42] Hamouda W, Lubin C, Ueda S, Yamashita Y, Renault O, Mehmood F, Mikolajick T, Schroeder U, Negrea R and Barrett N 2020 Appl. Phys. Lett. 116 252903 [43] Hamouda W, Pancotti A, Lubin C, Tortech L, Richter C, Mikolajick T, Schroeder U and Barrett N 2020 J. Appl. Phys. 127 064105 [44] Materano M, Lomenzo P D, Kersch A, Park M H, Mikolajick T and Schroeder U 2021 Inorg. Chem. Front. 8 2650 [45] Grimley E D, Schenk T, Sang X H, Pešić M, Schroeder U, Mikolajick T and LeBeau J M 2016 Adv. Electron. Mater. 2 1600173 [46] Li S D, Zhou D Y, Shi Z X, Hoffmann M, Mikolajick T and Schroeder U 2020 Adv. Electron. Mater. 6 2000264 [47] Ryu H, Xu Kai, Kim J H, Kang S, Guo J and Zhu W J 2019 IEEE Trans. Electron Devices 66 2359 [48] Pesic M, Fengler F P G, Larcher L, Padovani A, Schenk T, Grimley E D, Sang X, LeBeau J M, Slesazeck S, Schroeder U and Mikolajick T 2016 Adv. Funct. Mater. 26 4601 [49] Grimley D, Schenk T, Sang X, Pesic M, Schroeder U, Mikolajick T and LeBeau J M 2016 Adv. Electron. Mater. 2 1600173 [50] Kozodaev M G, Chernikova A G, Korostylev E V, Park M H, Khakimov R R, Hwang C S and Markeev A M 2019 J. Appl. Phys. 125 034101 [51] Mittmann T, Materano M, Lomenzo P D, Park M H, Stolichnov I, Cavalieri M, Zhou Z C, Chung C C, Jones J L, Szyjka T, Müller M, Kersch A, Mikolajick T and Schroeder U 2019 Adv. Mater. Interfaces 6 1900042 [52] Park M H, Kim H J, Kim Y J, Jeon W, Moon T and Hwang C S 2014 Phys. Status Solidi RRL 8 532 [53] Chernikova A G, Kozodaev M G, Negrov D V, Korostylev E V, Park M H, Schroeder U, Hwang C S and Markeev A M 2018 ACS Appl. Mater. Interfaces 10 2701 [54] Cao R R, Song B, Shang D S, Yang Y, Luo Q, Wu S Y, Li Y, Wang Y, Lv H B, Liu Q and Liu M 2019 IEEE Electron Device Lett. 40 1744 [55] Mulaosmanovic H, Breyer T E, Dünkel S, Beyer S, Mikolajick T and Slesazeck S 2021 Nanotechnology 32 502002 [56] Peng Y, Xiao W W, Liu Y, Jin C J, Deng X R, Zhang Y Y, Liu F N, Zheng Y Z, Cheng Y, Chen B, Yu X, Hao Y and Han G Q 2022 IEEE Electron Device Lett. 43 216 [57] Mehmood F, Hoffmann M, Lomenzo P D, Richter C, Materano M, Mikolajick T and Schroeder U 2019 Adv. Mater. Interfaces 6 1901180 [58] Gong N and Ma T P 2016 IEEE Electron. Device Lett. 37 1123 |