中国物理B ›› 2015, Vol. 24 ›› Issue (10): 108801-108801.doi: 10.1088/1674-1056/24/10/108801
• INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY • 上一篇 下一篇
张巍a, 陈晨a, 贾锐a, 孙昀a, 邢钊a, 金智a, 刘新宇a, 刘晓文b
Zhang Wei (张巍)a, Chen Chen (陈晨)a, Jia Rui (贾锐)a, Sun Yun (孙昀)a, Xing Zhao (邢钊)a, Jin Zhi (金智)a, Liu Xin-Yu (刘新宇)a, Liu Xiao-Wen (刘晓文)b
摘要: The n-type silicon integrated-back contact (IBC) solar cell has attracted much attention due to its high efficiency, whereas its performance is very sensitive to the wafer of low quality or the contamination during high temperature fabrication processing, which leads to low bulk lifetime τbulk . In order to clarify the influence of bulk lifetime on cell characteristics, two-dimensional (2D) TCAD simulation, combined with our experimental data, is used to simulate the cell performances, with the wafer thickness scaled down under various τbulk conditions. The modeling results show that for the IBC solar cell with high τbulk, (such as 1 ms-2 ms), its open-circuit voltage Voc almost remains unchanged, and the short-circuit current density Jsc monotonically decreases as the wafer thickness scales down. In comparison, for the solar cell with low τbulk (for instance, <500 s) wafer or the wafer contaminated during device processing, the Voc increases monotonically but the Jsc first increases to a maximum value and then drops off as the wafer's thickness decreases. A model combing the light absorption and the minority carrier diffusion is used to explain this phenomenon. The research results show that for the wafer with thinner thickness and high bulk lifetime, the good light trapping technology must be developed to offset the decrease in Jsc.
中图分类号: (Modeling and analysis)