中国物理B ›› 2008, Vol. 17 ›› Issue (6): 2130-2136.doi: 10.1088/1674-1056/17/6/031

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Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining

马瑾1, 欧毅2, 石莎莉2, 陈大鹏2, 叶甜春2, 易亮3   

  1. (1)School of Physics & Microelectronics, Shandong University, Jinan 250100, China; (2)Silicon Device & Integrated Technology Department, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China; (3)Silicon Device & Integrated Technology Department, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China;School of Physics & Microelectronics, Shandong University, Jinan 250100, China
  • 收稿日期:2007-09-08 修回日期:2007-10-17 出版日期:2008-06-20 发布日期:2008-06-20
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant No 60576053) and Technology Innovation of Chinese Academy of Sciences (Grant No CXJJ-176).

Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining

Yi Liang(易亮)a)b), Ou Yi(欧毅)a)†, Shi Sha-Li(石莎莉)a)‡, Ma Jin(马瑾)b), Chen Da-Peng(陈大鹏)a), and Ye Tian-Chun(叶甜春)a)   

  1. a  Silicon Device & Integrated Technology Department, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China; c School of Physics & Microelectronics, Shandong University, Jinan 250100, China
  • Received:2007-09-08 Revised:2007-10-17 Online:2008-06-20 Published:2008-06-20
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant No 60576053) and Technology Innovation of Chinese Academy of Sciences (Grant No CXJJ-176).

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摘要： This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2$\mu $m$\times $100$\mu $m, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200$\mu $m$\times $200$\mu $m$^{ }\times $400$\mu $m, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.

关键词: thermal micro shear stress sensor, vacuum anodic bonding, bulk-micromachined

Abstract: This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2$\mu $m$\times $100$\mu $m, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200$\mu $m$\times $200$\mu $m$^{ }\times $400$\mu $m, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.

Key words: thermal micro shear stress sensor, vacuum anodic bonding, bulk-micromachined

中图分类号:  (Micro- and nano-electromechanical systems (MEMS/NEMS) and devices)

  • 85.85.+j
07.07.Df (Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing) 81.20.Wk (Machining, milling) 81.65.Cf (Surface cleaning, etching, patterning)