中国物理B ›› 2006, Vol. 15 ›› Issue (8): 1849-1854.doi: 10.1088/1009-1963/15/8/037
• CLASSICAL AREAS OF PHENOMENOLOGY • 上一篇 下一篇
徐嘉庆1, 刘 波1, 宋志棠1, 封松林1, Bomy Chen2
Xu Jia-Qing(徐嘉庆)a)†, Liu Bo(刘波)a), Song Zhi-Tang(宋志棠)a), Feng Song-Lin(封松林)a), and Chen Bomyb)
摘要: To investigate the reliability of electrode materials for chalcogenide random access memory (C-RAM) applications, the geometry and time evolution of the worm-like delamination patterns on a tungsten/Sb$_{2}$Te$_{3}$ bilayer system surface are observed by field emission scanning electronic microscope (FESEM) and optical microscopy. The tungsten film stress and interface toughness are estimated using a straight-side model. After confirming the instability of this system being due to large compressive stress stored in the tungsten film and relative poor interface adhesion, a preliminary solution as the inset of a TiN adhesion layer is presented to improve the system performances.
中图分类号: (Mechanical and acoustical properties)