[1] |
Song X, Huang A Q, Lee M and Peng C 2017 IEEE Trans. Power Electr. 32 6381
doi: 10.1109/TPEL.2016.2616841
|
[2] |
Schrock J A, Hirsch E A, Lacouture S, Kelley M D, Bilbao A V, Ray W B, Bayne S B, Giesselmann M, O'Brien H and Ogunniyi A 2016 IEEE Trans. Power Electr. 31 8058
|
[3] |
Chow T P 2014 Mater. Sci. Forum 778 1077
|
[4] |
Wang J and Huang A Q 2009 IEEE Trans. Power Electr. 24 1189
doi: 10.1109/TPEL.2009.2013861
|
[5] |
Zhou C, Wang Y, Yue, R, Dai G and Li J 2017 IEEE Trans. Power Electr. 64 1193
|
[6] |
Mojab A, Mazumder S K 2015 IEEE Electron. Dev. Lett. 36 484
doi: 10.1109/LED.2015.2411218
|
[7] |
Hasegawa J, Pace L, Phung L V, Hatano M and Planson D 2017 IEEE Trans. Electron. Dev. 64 1203
doi: 10.1109/TED.2017.2657223
|
[8] |
Rumyantsev S L, Levinshtein M E, Saxena T, Shur M S, Cheng L, Palmour J W and Agarwal A 2014 Semicond. Sci. Tech. 29 115003
doi: 10.1088/0268-1242/29/11/115003
|
[9] |
Rumyantsev S L, Levinshtein M E, Shur M S, Saxena T, Zhang Q J, Agarwal A K and Palmour J W 2012 Semicond. Sci. Tech. 27 015012
doi: 10.1088/0268-1242/27/1/015012
|
[10] |
Mojab A, Mazumder S K, Cheng L, Agarwal A K and Soczzie C J IEEE 26th international Symposium on Power Semiconducvtor Devices & IC's, July 2014, Waikoloa HI, USA, pp. 313-316
|
[11] |
Levinshtein M E, Ivanov P A, Agarwal A K and Palmour J W 2002 Electron. Lett. 38 592
doi: 10.1049/el:20020415
|
[12] |
Dheilly N, Paques G, Scharnholz S, Bevilacqua P, Raynaud C, Nguyen D M, De Doncker R W and Planson D 2011 Electron. Lett. 47 459
doi: 10.1049/el.2010.7041
|
[13] |
Dheilly N, Planson D, Pâques G and Scharnholz S 2012 Solid-State Electron. 73 32
doi: 10.1016/j.sse.2012.02.007
|
[14] |
Mnatsakanov T T, Yurkov S N, Levinshtein M E, Cheng L and Palmour J W 2014 Semicond. Sci. Tech. 29 055005
doi: 10.1088/0268-1242/29/5/055005
|
[15] |
Levinshtein M E, Mnatsakanov T, Agarwal A K and Palmour J W 2011 Semicond. Sci. Tech. 26 055024
doi: 10.1088/0268-1242/26/5/055024
|
[16] |
Wang X, Pu H B, Liu Q, Chen C L and Chen Z M 2017 Chin. Phys. B 26 108505
doi: 10.1088/1674-1056/26/10/108505
|
[17] |
Zhang J, Fursin L, Li X, Wang X, Zhao J, VanMil B L, Myers-Ward R L, Eddy C R and Gaskill D K 2009 Mater. Sci. Forum 615-617 829
doi: 10.4028/www.scientific.net/MSF.615-617.829
|
[18] |
Yuan L, Zhang Y M, Song Q W, Tang X Y and Zhang Y M 2015 Chin. Phys. B 24 068502
doi: 10.1088/1674-1056/24/6/068502
|
[19] |
Davydov S Y 2007 Semiconductors 41 696
doi: 10.1134/S1063782607060152
|
[20] |
Galeckas A, Linnros J and Grivickas V 1997 Appl. Phys. Lett. 71 3269
doi: 10.1063/1.120309
|
[21] |
Liu Y, Wang Y, Hao Y, Yu C and Cao F 2017 IEEE Trans. Electron. Dev. 64 488
doi: 10.1109/TED.2016.2639548
|
[22] |
Kimoto T and Cooper J A 2014 Fundamentals Silicon Carbide Technology Growth Characterization Devices Applications (Singapore:John Wiley Sons) pp. 17-25, 511-515
|
[23] |
Niwa H, Suda J and Kimoto T 2014 Mater. Sci. Forum 778-780 461
doi: 10.4028/www.scientific.net/MSF.778-780.461
|