中国物理B ›› 2012, Vol. 21 ›› Issue (8): 84209-084209.doi: 10.1088/1674-1056/21/8/084209

• ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS • 上一篇    下一篇

Thermal analysis of GaN laser diodes in a package structure

冯美鑫a b, 张书明b, 江徳生a, 刘建平b, 王辉b, 曾畅a b, 李增成a b, 王怀兵b, 王峰b, 杨辉a b   

  1. a State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
    b Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China
  • 收稿日期:2011-12-15 修回日期:2012-02-21 出版日期:2012-07-01 发布日期:2012-07-01
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant Nos. 60506001, 60976045, 60836003, 60776047, and 61076119), the National Basic Research Program of China (Grant No. 2007CB936700), and the Funds for Outstanding Yong Researchers from the National Natural Science Foundation of China (Grant No. 60925017).

Thermal analysis of GaN laser diodes in a package structure

Feng Mei-Xin (冯美鑫)a b, Zhang Shu-Ming (张书明)b, Jiang De-Sheng (江徳生)a, Liu Jian-Ping (刘建平)b, Wang Hui (王辉)b, Zeng Chang (曾畅)a b, Li Zeng-Cheng (李增成)a b, Wang Huai-Bing (王怀兵)b, Wang Feng (王峰)b, Yang Hui (杨辉)a b   

  1. a State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
    b Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China
  • Received:2011-12-15 Revised:2012-02-21 Online:2012-07-01 Published:2012-07-01
  • Contact: Feng Mei-Xin E-mail:fengmeixin@semi.ac.cn
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant Nos. 60506001, 60976045, 60836003, 60776047, and 61076119), the National Basic Research Program of China (Grant No. 2007CB936700), and the Funds for Outstanding Yong Researchers from the National Natural Science Foundation of China (Grant No. 60925017).

摘要: Using the finite-element method, the thermal resistances of GaN laser diode devices in TO 56 package for both epi-up configuration and epi-down configuration are calculated. The effects of various parameters on the thermal characteristics are analysed, and the thicknesses of AlN submount for both epi-up configuration and epi-down configuration are optimized. The obtained result provides a reference for the parameter selection of the package materials.

关键词: laser diodes, thermal, GaN

Abstract: Using the finite-element method, the thermal resistances of GaN laser diode devices in TO 56 package for both epi-up configuration and epi-down configuration are calculated. The effects of various parameters on the thermal characteristics are analysed, and the thicknesses of AlN submount for both epi-up configuration and epi-down configuration are optimized. The obtained result provides a reference for the parameter selection of the package materials.

Key words: laser diodes, thermal, GaN

中图分类号:  (Semiconductor lasers; laser diodes)

  • 42.55.Px
61.72.uj (III-V and II-VI semiconductors) 68.60.Dv (Thermal stability; thermal effects)