中国物理B ›› 2012, Vol. 21 ›› Issue (8): 84209-084209.doi: 10.1088/1674-1056/21/8/084209
• ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS • 上一篇 下一篇
冯美鑫a b, 张书明b, 江徳生a, 刘建平b, 王辉b, 曾畅a b, 李增成a b, 王怀兵b, 王峰b, 杨辉a b
Feng Mei-Xin (冯美鑫)a b, Zhang Shu-Ming (张书明)b, Jiang De-Sheng (江徳生)a, Liu Jian-Ping (刘建平)b, Wang Hui (王辉)b, Zeng Chang (曾畅)a b, Li Zeng-Cheng (李增成)a b, Wang Huai-Bing (王怀兵)b, Wang Feng (王峰)b, Yang Hui (杨辉)a b
摘要: Using the finite-element method, the thermal resistances of GaN laser diode devices in TO 56 package for both epi-up configuration and epi-down configuration are calculated. The effects of various parameters on the thermal characteristics are analysed, and the thicknesses of AlN submount for both epi-up configuration and epi-down configuration are optimized. The obtained result provides a reference for the parameter selection of the package materials.
中图分类号: (Semiconductor lasers; laser diodes)