[1] Wong H S P and Salahuddin S 2015 Nat. Nanotech. 10 191 [2] Waser R, Dittmann R, Staikov G and Szot K 2009 Adv. Mater. 21 2632 [3] Ielmini D 2016 Semicond. Sci. Technol. 31 063002 [4] Zahoor F, Nisar A, Bature U I, Abbas H, Bashir F, Chattopadhyay A, Kaushik B K, Alzahrani A and Hussin F A 2024 Nanoscale Adv. 6 4980 [5] Yang Y, Zhao J, Liu Y, Hua X, Wang T, Zheng J, Hao Z, Xiong B, Sun C, Han Y, Wang J, Li H, Wang L and Luo Y 2024 Chin. Phys. B 33 030702 [6] Wang Z, Wu H, Burr G W, Hwang C S, Wang K L, Xia Q and Yang J J 2020 Nat. Rev. Mater. 5 173 [7] Chen S and Valov I 2022 Adv. Mater. 34 2105022 [8] Rehman M M, Yang B S, Yang Y J, Karimov K S and Choi K H 2017 Curr. Appl. Phys. 17 533 [9] Sawa A 2008 Mater. Today 11 28 [10] Munir F, Schon D, Menzel S, Stasner P, Waser R and Wiefels S 2024 IEEE Trans. Electron Dev. 71 6691 [11] Yang J J, Strukov D B and Stewart D R 2013 Nat. Nanotechnol. 8 13 [12] Pan F, Gao S, Chen C, Song C and Zeng F 2014 Mater. Sci. Eng. R Rep. 83 1 [13] Zhang W, Lei J, Dai Y, Zhang X, Kang L, Peng B and Hu F 2022 Nanotechnology 33 255703 [14] Jiang Z, Zhang W, Bao J, Cheng H, Zhang X and Hu F 2020 Ceram. Int. 46 24838 [15] Hsu C C, Wang T C and Tsao C C 2018 J. Alloys Compd. 769 65 [16] Tsai T L, Chang H Y, Lou J J C and Tseng T Y 2016 Appl. Phys. Lett. 108 153505 [17] Li Y, Long S, Zhang M, Liu Q, Shao L, Zhang S, Wang Y, Zuo Q, Liu S and Liu M 2010 IEEE Electron Dev. Lett. 31 117 [18] Lee J, Bourim E M, Lee W and Hwang H 2010 Appl. Phys. Lett. 97 172105 [19] Kamata Y, Kamimuta Y, Ino T, Nabatame T and Torii K 2005 Jpn. J. Appl. Phys. 44 2323 [20] Lee S, Kim T, Jang B, Lee W, Song K C, Kim H S, Do G Y, Hwang S B, Chung S and Jang J 2018 IEEE Electron Dev. Lett. 39 668 [21] Wang S Y, Lee D Y, Huang T Y, Wu J W and Tseng T Y 2010 Nanotechnology 21 495201 [22] Wong H S P, Lee H Y, Yu S, Chen Y S, Wu Y, Chen P S, Lee B, Chen F T and Tsai M J 2012 Proc. IEEE 100 1951 [23] Huang X, Wang Y, Huang H, Duan L and Guo T 2024 Chin. Phys. B 33 017303 [24] Li Y, Long S, Lv H, Liu Q, Wang Y, Zhang S, Lian W, Wang M, Zhang K, Xie H, Liu S and Liu M 2011 Nanotechnology 22 254028 [25] Liu H C, Tang X G, Liu Q X, Jiang Y P, Li W H, Guo X B and Tang Z H 2020 Ceram. Int. 46 21196 [26] Choi K and Pak J J 2024 Semicond. Sci. Technol. 39 045012 [27] Jang B, Kim J, Lee J, Jang J and Kwon H 2024 J. Mater. Sci. Technol. 189 68 [28] Marikkannan M, Subramanian M, Mayandi J, Tanemura M, Vishnukanthan V and Pearce J M 2015 AIP Adv. 5 017128 [29] Marchewka A, Roesgen B, Skaja K Skaja K, Du H, Jia C L, Mayer J, Rana V, Waser R and Menzel S 2016 Adv. Electron. Mater. 2 1500233 [30] Zhang W, Guo Z, Dai Y, Lei J, Wang J and Hu F 2023 Ceram. Int. 49 35973 [31] Huang Y, Shen Z, Wu Y, Xie M, Hu Y, Zhang S, Shi X and Zeng H 2016 AIP Adv. 6 025018 [32] Saitoh S and Kinoshita K 2020 Appl. Phys. Lett. 116 112101 [33] Wang X, Sun B, Li X, Guo B, Zeng Y, Mao S, Zhu S, Xia Y, Tian S and Luo W 2018 Ceram. Int. 44 18108 [34] Ismail M, Abbas H, Choi C and Kim S 2020 J. Alloys Compd. 835 155256 [35] Ali S, Hussain M, Ismail M, Iqbal M W and Kim S 2024 J. Alloys Compd. 997 174802 [36] Lata L K and Jain P K 2023 Emergent Mater. 6 1979 [37] Zhang W, Ouyang J, Kang L M, Cheng H B, Yang Q and Hu F R 2015 J. Mater. Sci.: Mater. Electron. 26 9962 [38] Kim W, Menzel S, Wouters D J, Waser R and Rana V 2016 IEEE Electron Dev. Lett. 37 564 [39] Zhang W, Peng B, Kang L, Hu F, Cheng H and Wang Y 2022 Mater. Res. Bull. 145 111553 |