中国物理B ›› 2022, Vol. 31 ›› Issue (2): 24203-024203.doi: 10.1088/1674-1056/ac0dac
Shao-Yang Li(李绍洋)1,3, Liang-Liang Wang(王亮亮)1,†, Dan Wu(吴丹)1,3, Jin You(游金)1,3, Yue Wang(王玥)1, Jia-Shun Zhang(张家顺)1, Xiao-Jie Yin(尹小杰)1, Jun-Ming An(安俊明)1,2,3, and Yuan-Da Wu(吴远大)1,2,3
Shao-Yang Li(李绍洋)1,3, Liang-Liang Wang(王亮亮)1,†, Dan Wu(吴丹)1,3, Jin You(游金)1,3, Yue Wang(王玥)1, Jia-Shun Zhang(张家顺)1, Xiao-Jie Yin(尹小杰)1, Jun-Ming An(安俊明)1,2,3, and Yuan-Da Wu(吴远大)1,2,3
摘要: Since the advent of three-dimensional photonic integrated circuits, the realization of efficient and compact optical interconnection between layers has become an important development direction. A vertical interlayer coupler between two silicon layers is presented in this paper. The coupling principle of the directional coupler is analyzed, and the traditional method of using a pair of vertically overlapping inverse taper structures is improved. For the coupling of two rectangular waveguide layers, a pair of nonlinear tapers with offset along the transmission direction is demonstrated. For the coupling of two ridge waveguide layers, a nonlinear taper in each layer is used to achieve high coupling efficiency. The simulation results show that the coupling efficiency of the two structures can reach more than 90% in a wavelength range from 1500 nm to 1650 nm. Moreover, the crosstalk is reduced to less than -50 dB by using multimode waveguides at intersections. The vertical interlayer coupler with a nonlinear taper is expected to realize the miniaturization and dense integration of photonic integrated chips.
中图分类号: (Integrated optics)