中国物理B ›› 2023, Vol. 32 ›› Issue (10): 106104-106104.doi: 10.1088/1674-1056/acb41f
Thermal stress damage mechanism in single-crystal germanium caused by 1080 nm laser irradiation
Yin-Chuan Sha(沙银川)1,†, Ze-Wen Li(李泽文)1,†‡, Zhi-Chao Jia(贾志超)2, Bing Han(韩冰)3, and Xiao-Wu Ni(倪晓武)1
- 1 School of Science, Nanjing University of Science and Technology, Nanjing 210094, China;
2 School of Materials Engineering, Jinling Institute of Technology, Nanjing 211169, China;
3 School of Electronic Engineering and Optical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
Thermal stress damage mechanism in single-crystal germanium caused by 1080 nm laser irradiation
Yin-Chuan Sha(沙银川)1,†, Ze-Wen Li(李泽文)1,†‡, Zhi-Chao Jia(贾志超)2, Bing Han(韩冰)3, and Xiao-Wu Ni(倪晓武)1
- 1 School of Science, Nanjing University of Science and Technology, Nanjing 210094, China;
2 School of Materials Engineering, Jinling Institute of Technology, Nanjing 211169, China;
3 School of Electronic Engineering and Optical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
摘要： The process of thermal stress damage during 1080 nm laser ablation of single-crystal germanium was recorded in real time using a high-speed charge-coupled device. A three-dimensional finite element numerical model based on Fourier's heat conduction equation, Hooke's law and the Alexander-Hasson equation was developed to analyze the thermal stress damage mechanism involved. The damage morphology of the ablated samples was observed using an optical microscope. The results show that the cooling process has an important influence on fracture in the laser-irradiated region of single-crystal germanium. Fracture is the result of a combination of thermal stress and reduction in local yield strength.
中图分类号: (Semiconductors)
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