[1] Bhatnagar M and Baliga B J 1993 IEEE Transactions on Electron Devices 40 645 [2] Óstling M, Ghandi R and Zetterling C 2011 IEEE International Symposium on Power Semiconductor Devices & Ics, May 23-26, 2011, San Diego, CA, USA, p. 1 [3] Elasser A and Chow T P 2002 Proceedings of the IEEE 90 969 [4] Heinze B, Lutz J, Neumeister M, Rupp R and Holz M 2008 20th International Symposium on Power Semiconductor Devices and IC's, May 18-22, 2008, Oralando FL, USA, p. 245 [5] Banu V, Soler V and Montserrat J 2016 Microelectronics Reliability 64 429 [6] Brunt E V, Barbieri T, Barkley A, Solovey J, Richmond J and Hull B 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs, May 13-17, 2018, Chicago, USA, p. 415 [7] Huang X, Wang G, Lee M and Huang A Q 2012 IEEE Energy Conversion Congress and Exposition, September 15-20, 2012, Raleigh, NC, USA, p. 2245 [8] Ren N, Wu J P, Liu L and Sheng K 2020 IEEE Transactions on Power Electronics 35 11316 [9] Alessandro V, Irace A, Breglio G, Spirito P, Bricconi A, Carta R, Raffo D and Merlin L 2006 IEEE International Symposium on Power Semiconductor Devices and IC's, June 4-8, 2006, Naples, Italy, pp. 1 [10] Wu J P, Ren N, Wang H and Sheng K 2019 IEEE Journal of Emerging and Selected Topics in Power Electronics 7 1496 [11] Jiang Y, Sung W, Song X, Ke H and Brunt E V 2016 28th International Symposium on Power Semiconductor Devices and ICs, June 12-16, 2016, Prague, Czech Republic, p. 43 [12] Huang Y and Wachutka G 2016 International Conference on Simulation of Semiconductor Processes and Devices, September 06-08, 2016, Nuremberg, Germany, p. 117 [13] Palanisamy S, Fichtner S, Lutz J, Basler T and Rupp R 2016 28th International Symposium on Power Semiconductor Devices and ICs, June 12-16, 2016, Prague, Czech Republic, p. 235 [14] Huang Y, Erlbacher T, Buettner J and Wachutka G 2016 28th International Symposium on Power Semiconductor Devices and ICs, June 12-16, 2016, Prague, Czech Republic, p. 63 [15] Zhong W, Tang Y, Li C, Chen H and Liu X 2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China, November 25-27, 2019, Shenzhen, China, p. 22 [16] Leon J, Perpina X, Banu V, Montserrat J, Berthou M and Vellvehi M 2014 Microelectronics Reliability 54 2207 [17] Snead L L, Nozawa T and Katoh Y 2007 Journal of Nuclear Materials 371 329 [18] ATLAS User's Manual, Silvaco, Santa Clara, CA, USA, 2016 [19] Fichtner S, Lutz J, Basler T, Rupp R and Gerlach R 2014 8th International Conference on Integrated Power Electronics Systems, February 25-27, 2014, Nuremberg, Germany, pp. 1 [20] Zhou F, Xu W, Ren F, Zhou D, Chen D, Zhang R, Zheng Y, Zhu T and Lu H 2021 IEEE Transactions on Power Electronics 36 12163 [21] Jiang X, Zhai D, Chen J, Yuan F, Li Z, He Z, Shen Z J and Wang J 2018 IEEE Energy Conversion Congress and Exposition (ECCE), September 23-27, 2018, Portland, OR, USA, p. 845 [22] Du Q and Tao X 2020 IEEE Transactions on Electron Devices 67 4033 [23] Niwa H, Suda J and Kimoto T 2017 IEEE Transactions on Electron Devices 64 874 [24] Ren N, Liu L, Wu J P and Sheng K 2021 IEEE Transactions on Electron Devices 68 5687 [25] Wang A T, Bai Y, Tang Y D, Li C Z, Han Z L, Lu J, Chen H, Tian X L, Yang C Y, Hao J L and Liu X Y 2021 IEEE Transactions on Electron Devices 68 6330 |