Thermal and mechanical characterizations of asubstrate-free focal plane array

doi:10.1088/1674-1056/19/1/010701

中国物理B ›› 2010, Vol. 19 ›› Issue (1): 10701-010701.doi: 10.1088/1674-1056/19/1/010701

Thermal and mechanical characterizations of asubstrate-free focal plane array

程腾¹, 张青川¹, 史海涛¹, 高杰¹, 钱剑¹, 伍小平¹, 陈大鹏²

(1)CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei 230027, China; (2)Institute of Microelectronics, Chinese Academy of Science, Beijing 100029, China

收稿日期:2009-03-20 修回日期:2009-05-18 出版日期:2010-01-15 发布日期:2010-01-15
基金资助:
Project supported by the National Natural Science Foundation of China (Grant Nos. 10732080 and 10627201), and the National Basic Research Program of China (Grant No. 2006CB300404).

Thermal and mechanical characterizations of a substrate-free focal plane array

Cheng Teng(程腾)^a), Zhang Qing-Chuan(张青川)^a)†, Chen Da-Peng(陈大鹏)^b), Shi Hai-Tao(史海涛)^a), Gao Jie(高杰)^a), Qian Jian(钱剑)^a), and Wu Xiao-Ping(伍小平)^a)

^a CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei 230027, China; ^b Institute of Microelectronics, Chinese Academy of Science, Beijing 100029, China

Received:2009-03-20 Revised:2009-05-18 Online:2010-01-15 Published:2010-01-15
Supported by:
Project supported by the National Natural Science Foundation of China (Grant Nos. 10732080 and 10627201), and the National Basic Research Program of China (Grant No. 2006CB300404).

摘要/Abstract

摘要： We propose a substrate-free focal plane array (FPA) in this paper. The solid substrate is completely removed, and the microcantilevers extend from a supporting frame. Using finite element analysis, the thermal and mechanical characterizations of the substrate-free FPA are presented. Because of the large decrease in thermal conductance, the supporting frame is temperature dependent, which brings out a unique feature: the lower the thermal conductance of the supporting frame is, the higher the energy conversion efficiency in the substrate-free FPA will be. The results from the finite element analyses are consistent with our measurements: two types of substrate-free FPAs with pixel sizes of 200× 200 and 60× 60~μ m² are implemented in the proposed infrared detector. The noise equivalent temperature difference (NETD) values are experimentally measured to be 520 and 300~mK respectively. Further refinements are considered in various aspects, and the substrate-free FPA with a pixel size of 30× 30~μ m² has a potential of achieving an NETD value of 10~mK.

Abstract: We propose a substrate-free focal plane array (FPA) in this paper. The solid substrate is completely removed, and the microcantilevers extend from a supporting frame. Using finite element analysis, the thermal and mechanical characterizations of the substrate-free FPA are presented. Because of the large decrease in thermal conductance, the supporting frame is temperature dependent, which brings out a unique feature: the lower the thermal conductance of the supporting frame is, the higher the energy conversion efficiency in the substrate-free FPA will be. The results from the finite element analyses are consistent with our measurements: two types of substrate-free FPAs with pixel sizes of 200× 200 and 60 × 60 μm² are implemented in the proposed infrared detector. The noise equivalent temperature difference (NETD) values are experimentally measured to be 520 and 300~mK respectively. Further refinements are considered in various aspects, and the substrate-free FPA with a pixel size of 30 × 30 μm² has a potential of achieving an NETD value of 10 mK.

Key words: focal plane array, infrared detectors, substrate-free, uncooled

中图分类号: (Bolometers; infrared, submillimeter wave, microwave, and radiowave receivers and detectors)

07.57.Kp

02.70.Dh (Finite-element and Galerkin methods) 07.10.Cm (Micromechanical devices and systems) 85.60.Gz (Photodetectors (including infrared and CCD detectors))

程腾, 张青川, 陈大鹏, 史海涛, 高杰, 钱剑, 伍小平. Thermal and mechanical characterizations of asubstrate-free focal plane array[J]. 中国物理B, 2010, 19(1): 10701-010701.

Cheng Teng(程腾), Zhang Qing-Chuan(张青川), Chen Da-Peng(陈大鹏), Shi Hai-Tao(史海涛), Gao Jie(高杰), Qian Jian(钱剑), and Wu Xiao-Ping(伍小平). Thermal and mechanical characterizations of a substrate-free focal plane array[J]. Chin. Phys. B, 2010, 19(1): 10701-010701.

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Thermal and mechanical characterizations of asubstrate-free focal plane array

Thermal and mechanical characterizations of a substrate-free focal plane array

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