中国物理B ›› 2005, Vol. 14 ›› Issue (7): 1471-1476.doi: 10.1088/1009-1963/14/7/036
赵小伟1, 高燕1, 王健雄1, 宋礼1, 刘东方1, 刘利峰1, 窦新元1, 罗述东1, 张增星1, 向彦娟1, 周维亚1, 王刚1, 江鹏2
Zhao Xiao-Wei (赵小伟)a, Jiang Peng (江鹏)b, Gao Yan (高燕)a, Wang Jian-Xiong (王健雄)a, Song Li (宋礼)a, Liu Dong-Fang (刘东方)a, Liu Li-Feng (刘利峰)a, Dou Xin-Yuan (窦新元)a, Luo Shu-Dong (罗述东)a, Zhang Zeng-Xing (张增星)a, Xiang Yan-Juan (向彦娟)a, Zhou Wei-Ya (周维亚)a, Wang Gang (王刚)a
摘要: Three-dimensional micro- and nanometre composite aluminium patterns are constructed on Al substrate by using photolithography, reactive ion etching and anodization. A layer of patterned SiO$_{2}$ mask is introduced as resist on the surface of Al foil, and during anodization the tilted nanopores and remaining Al microstructure are formed underneath the SiO$_{2}$ mask. The existence of SiO$_{2}$ mask leads to the deflection of electric field and effect on the transportation of ions, which results in the formation of laterally tilted nanopores, while the nanopores go down directly when being far from the boundaries of SiO$_{2}$. The vertical and lateral anodization processes proceeding simultaneously construct the Al microstructure under the patterned SiO$_{2}$ mask.
中图分类号: (Micro- and nanoscale pattern formation)