中国物理B ›› 2010, Vol. 19 ›› Issue (11): 118103-118104.doi: 10.1088/1674-1056/19/11/118103

• CROSS DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY • 上一篇    下一篇

Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique

孙启明, 高椿明, 赵斌兴, 饶海波   

  1. School of Opto-Electronic Information, University of Electronic Science and Technology of China, Chengdu 610054, China
  • 收稿日期:2009-10-19 修回日期:2010-05-05 出版日期:2010-11-15 发布日期:2010-11-15
  • 基金资助:
    Project supported by the National Nature Science Foundation of China (Grant No. 50506006), the National High Technology Research and Development Program of China (Grant No. 2006AA03A116), and the Youth Foundation of University of Electronic Science and Technology of China (Grant No. JX05024).

Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique

Sun Qi-Ming(孙启明), Gao Chun-Ming(高椿明), Zhao Bin-Xing(赵斌兴), and Rao Hai-Bo(饶海波)   

  1. School of Opto-Electronic Information, University of Electronic Science and Technology of China, Chengdu 610054, China
  • Received:2009-10-19 Revised:2010-05-05 Online:2010-11-15 Published:2010-11-15
  • Supported by:
    Project supported by the National Nature Science Foundation of China (Grant No. 50506006), the National High Technology Research and Development Program of China (Grant No. 2006AA03A116), and the Youth Foundation of University of Electronic Science and Technology of China (Grant No. JX05024).

摘要: Thermal property is one of the most important properties of light-emitting diode (LED). Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly having an influence on the light-emitting efficiency and the life-span of the device. In this paper, photoacoustic piezoelectric (PAPE) technique has been employed to investigate the thermal properties of polyvinyl alcohol (PVA) and silicon dioxide, which are the new and the traditional packaging materials in white LED, respectively. Firstly, the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials; secondly, the experimental system has been set up and adjusted by measuring the reference sample; thirdly, the thermal diffusivities of PVA and silicon dioxide are measured and analysed. The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.

Abstract: Thermal property is one of the most important properties of light-emitting diode (LED). Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly having an influence on the light-emitting efficiency and the life-span of the device. In this paper, photoacoustic piezoelectric (PAPE) technique has been employed to investigate the thermal properties of polyvinyl alcohol (PVA) and silicon dioxide, which are the new and the traditional packaging materials in white LED, respectively. Firstly, the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials; secondly, the experimental system has been set up and adjusted by measuring the reference sample; thirdly, the thermal diffusivities of PVA and silicon dioxide are measured and analysed. The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.

Key words: thermal diffusivity, photoacoustic piezoelectric technique, two-layer model, LED packaging material

中图分类号:  (Optoelectronic device characterization, design, and modeling)

  • 85.60.Bt
85.60.Jb (Light-emitting devices)