中国物理B ›› 2016, Vol. 25 ›› Issue (12): 127301-127301.doi: 10.1088/1674-1056/25/12/127301
• CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES • 上一篇 下一篇
Xiao-Jie Jia(贾晓洁), Chun-Lan Zhou(周春兰), Jun-Jie Zhu(朱俊杰), Su Zhou(周肃), Wen-Jing Wang(王文静)
Xiao-Jie Jia(贾晓洁)1, Chun-Lan Zhou(周春兰)1, Jun-Jie Zhu(朱俊杰)2, Su Zhou(周肃)1, Wen-Jing Wang(王文静)1
摘要:
It is studied in this paper that the electrical characteristics of the interface between SiOyNx/SiNx stack and silicon wafer affect silicon surface passivation. The effects of precursor flow ratio and deposition temperature of the SiOyNx layer on interface parameters, such as interface state density Dit and fixed charge Qf, and the surface passivation quality of silicon are observed. Capacitance-voltage measurements reveal that inserting a thin SiOyNx layer between the SiNx and the silicon wafer can suppress Qf in the film and Dit at the interface. The positive Qf and Dit and a high surface recombination velocity in stacks are observed to increase with the introduced oxygen and minimal hydrogen in the SiOyNx film increasing. Prepared by deposition at a low temperature and a low ratio of N2O/SiH4 flow rate, the SiOyNx/SiNx stacks result in a low effective surface recombination velocity (Seff) of 6 cm/s on a p-type 1 Ω·cm-5 Ω·cm FZ silicon wafer. The positive relationship between Seff and Dit suggests that the saturation of the interface defect is the main passivation mechanism although the field-effect passivation provided by the fixed charges also make a contribution to it.
中图分类号: (Surface states, band structure, electron density of states)