中国物理B ›› 2023, Vol. 32 ›› Issue (7): 78503-078503.doi: 10.1088/1674-1056/ac8ce6

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High-performance vertical GaN field-effect transistor with an integrated self-adapted channel diode for reverse conduction

Siyu Deng(邓思宇), Dezun Liao(廖德尊), Jie Wei(魏杰), Cheng Zhang(张成),Tao Sun(孙涛), and Xiaorong Luo(罗小蓉)   

  1. University of Electronic Science and Technology of China, Chengdu 611731, China
  • 收稿日期:2022-07-03 修回日期:2022-08-19 接受日期:2022-08-26 出版日期:2023-06-15 发布日期:2023-07-10
  • 通讯作者: Xiaorong Luo E-mail:xrluo@uestc.edu.cn
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant Nos. 61874149 and U20A20208) and the Outstanding Youth Science and Technology Foundation of China (Grant No. 2018-JCJQ-ZQ-060).

High-performance vertical GaN field-effect transistor with an integrated self-adapted channel diode for reverse conduction

Siyu Deng(邓思宇), Dezun Liao(廖德尊), Jie Wei(魏杰), Cheng Zhang(张成),Tao Sun(孙涛), and Xiaorong Luo(罗小蓉)   

  1. University of Electronic Science and Technology of China, Chengdu 611731, China
  • Received:2022-07-03 Revised:2022-08-19 Accepted:2022-08-26 Online:2023-06-15 Published:2023-07-10
  • Contact: Xiaorong Luo E-mail:xrluo@uestc.edu.cn
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant Nos. 61874149 and U20A20208) and the Outstanding Youth Science and Technology Foundation of China (Grant No. 2018-JCJQ-ZQ-060).

摘要: A vertical GaN field-effect transistor with an integrated self-adapted channel diode (CD-FET) is proposed to improve the reverse conduction performance. It features a channel diode (CD) formed between a trench source on the insulator and a P-type barrier layer (PBL), together with a P-shield layer under the trench gate. At forward conduction, the CD is pinched off due to depletion effects caused by both the PBL and the metal-insulator-semiconductor structure from the trench source, without influencing the on-state characteristic of the CD-FET. At reverse conduction, the depletion region narrows and thus the CD turns on to achieve a very low turn-on voltage ($V_{\rm F}$), preventing the inherent body diode from turning on. Meanwhile, the PBL and P-shield layer can modulate the electric field distribution to improve the off-state breakdown voltage (${\rm BV}$). Moreover, the P-shield not only shields the gate from a high electric field but also transforms part of $C_{\rm GD}$ to $C_{\rm GS}$ so as to significantly reduce the gate charge ($Q_{\rm GD}$), leading to a low switching loss ($E_{\rm switch}$). Consequently, the proposed CD-FET achieves a low $V_{\rm F}$ of 1.65 V and a high ${\rm BV}$ of 1446 V, and $V_{\rm F}$, $Q_{\rm GD}$ and $E_{\rm switch}$ of the CD-FET are decreased by 49%, 55% and 80%, respectively, compared with those of a conventional metal-oxide-semiconductor field-effect transistor (MOSFET).

关键词: GaN field effect transistor, reverse conduction, integrated diode, turn-on voltage

Abstract: A vertical GaN field-effect transistor with an integrated self-adapted channel diode (CD-FET) is proposed to improve the reverse conduction performance. It features a channel diode (CD) formed between a trench source on the insulator and a P-type barrier layer (PBL), together with a P-shield layer under the trench gate. At forward conduction, the CD is pinched off due to depletion effects caused by both the PBL and the metal-insulator-semiconductor structure from the trench source, without influencing the on-state characteristic of the CD-FET. At reverse conduction, the depletion region narrows and thus the CD turns on to achieve a very low turn-on voltage ($V_{\rm F}$), preventing the inherent body diode from turning on. Meanwhile, the PBL and P-shield layer can modulate the electric field distribution to improve the off-state breakdown voltage (${\rm BV}$). Moreover, the P-shield not only shields the gate from a high electric field but also transforms part of $C_{\rm GD}$ to $C_{\rm GS}$ so as to significantly reduce the gate charge ($Q_{\rm GD}$), leading to a low switching loss ($E_{\rm switch}$). Consequently, the proposed CD-FET achieves a low $V_{\rm F}$ of 1.65 V and a high ${\rm BV}$ of 1446 V, and $V_{\rm F}$, $Q_{\rm GD}$ and $E_{\rm switch}$ of the CD-FET are decreased by 49%, 55% and 80%, respectively, compared with those of a conventional metal-oxide-semiconductor field-effect transistor (MOSFET).

Key words: GaN field effect transistor, reverse conduction, integrated diode, turn-on voltage

中图分类号:  (Semiconductor-device characterization, design, and modeling)

  • 85.30.De
85.30.Tv (Field effect devices) 73.40.Qv (Metal-insulator-semiconductor structures (including semiconductor-to-insulator)) 51.50.+v (Electrical properties)