中国物理B ›› 2020, Vol. 29 ›› Issue (2): 26101-026101.doi: 10.1088/1674-1056/ab5fc4
• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇 下一篇
Bing Ye(叶兵), Li-Hua Mo(莫莉华), Tao Liu(刘涛), Jie Luo(罗捷), Dong-Qing Li(李东青), Pei-Xiong Zhao(赵培雄), Chang Cai(蔡畅), Ze He(贺泽), You-Mei Sun(孙友梅), Ming-Dong Hou(侯明东), Jie Liu(刘杰)
Bing Ye(叶兵)1, Li-Hua Mo(莫莉华)1,2, Tao Liu(刘涛)3, Jie Luo(罗捷)1, Dong-Qing Li(李东青)1,2, Pei-Xiong Zhao(赵培雄)1,2, Chang Cai(蔡畅)1,2, Ze He(贺泽)1,2, You-Mei Sun(孙友梅)1, Ming-Dong Hou(侯明东)1, Jie Liu(刘杰)1
摘要: Geant4 Monte Carlo simulation results of the single event upset (SEU) induced by protons with energy ranging from 0.3 MeV to 1 GeV are reported. The SEU cross section for planar and three-dimensional (3D) die-stacked SRAM are calculated. The results show that the SEU cross sections of the planar device and the 3D device are different from each other under low energy proton direct ionization mechanism, but almost the same for the high energy proton. Besides, the multi-bit upset (MBU) ratio and pattern are presented and analyzed. The results indicate that the MBU ratio of the 3D die-stacked device is higher than that of the planar device, and the MBU patterns are more complicated. Finally, the on-orbit upset rate for the 3D die-stacked device and the planar device are calculated by SPACE RADIATION software. The calculation results indicate that no matter what the orbital parameters and shielding conditions are, the on-orbit upset rate of planar device is higher than that of 3D die-stacked device.
中图分类号: (Semiconductors)