中国物理B ›› 1994, Vol. 3 ›› Issue (9): 682-689.doi: 10.1088/1004-423X/3/9/005

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INVESTIGATION ON THE COMPOSITION AND STRUCTURE OF SILICON NITRIDE FILM PREPARED BY ECR-PECVD

宁兆元1, 吴雪梅1, 陈俊芳2, 程绍玉2, 任兆杏2, 张束清2   

  1. (1)Department of Physics Suzhou University, Suzhou 215006, China; (2)Institute of Plasma Physics, Academia Sinica, Hefei 230031, China
  • 收稿日期:1993-07-22 出版日期:1994-09-20 发布日期:1994-09-20

INVESTIGATION ON THE COMPOSITION AND STRUCTURE OF SILICON NITRIDE FILM PREPARED BY ECR-PECVD

CHEN JUN-FANG (陈俊芳)a, CHENG SHAO-YU (程绍玉)a, REN ZHAO-XING (任兆杏)a, ZHANG SU-QING (张束清)a, NING ZHAO-YUAN (宁兆元)b, WU XUE-MEI (吴雪梅)b   

  1. a Institute of Plasma Physics, Academia Sinica, Hefei 230031, China b Department of Physics Suzhou University, Suzhou 215006, China;
  • Received:1993-07-22 Online:1994-09-20 Published:1994-09-20

摘要: In this paper, the effect of temperature on the composition and structure of the Si3N4 thin film is investigated. X-ray diffraction pattern and transmission electron microscope (TEM) analyses show that the Si3N4 film undergoes the transition from amorphous to crystalline phase with increasing deposition temperature. Infra-red qualitative analysis shows that the content of hydrogen decreases with increasing deposition temperature.The stoichiometric of Si3N4 is investigated by X-ray photoelectron spectroscopy or electron spectroscopy for chemical analysis.

Abstract: In this paper, the effect of temperature on the composition and structure of the Si3N4 thin film is investigated. X-ray diffraction pattern and transmission electron microscope (TEM) analyses show that the Si3N4 film undergoes the transition from amorphous to crystalline phase with increasing deposition temperature. Infra-red qualitative analysis shows that the content of hydrogen decreases with increasing deposition temperature.The stoichiometric of Si3N4 is investigated by X-ray photoelectron spectroscopy or electron spectroscopy for chemical analysis.

中图分类号:  (Composition and phase identification)

  • 68.55.Nq
68.55.A- (Nucleation and growth) 68.55.-a (Thin film structure and morphology) 81.15.Gh (Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.)) 61.50.Nw (Crystal stoichiometry)