中国物理B ›› 2021, Vol. 30 ›› Issue (12): 120701-120701.doi: 10.1088/1674-1056/ac05af
A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines
Huali Zhu(朱华利), Yong Zhang(张勇)†, Kun Qu(屈坤), Haomiao Wei(魏浩淼), Yukun Li(黎雨坤), Yuehang Xu(徐跃杭), and Ruimin Xu(徐锐敏)
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines
Huali Zhu(朱华利), Yong Zhang(张勇)†, Kun Qu(屈坤), Haomiao Wei(魏浩淼), Yukun Li(黎雨坤), Yuehang Xu(徐跃杭), and Ruimin Xu(徐锐敏)
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
摘要： This article presents the design and performance of a terahertz on-chip coupled-grounded coplanar waveguide (GCPW) power combiner using a 50 μm-thick InP process. The proposed topology uses two coupled-GCPW lines at the end of the input port to substitute two quarter-wavelength GCPW lines, which is different from the conventional Wilkinson power combiner and can availably minimize the coverage area. According to the results obtained, for the frequency range of 210-250 GHz, the insertion losses for each two-way combiner and four-way combiner were lower than 1.05 dB and 1.35 dB, respectively, and the in-band return losses were better than 11 dB. Moreover, the proposed on-chip GCPW-based combiners achieved a compromise in low-loss, broadband, and small-size, which can find wide applications in terahertz bands, such as power amplifiers and signal distribution networks.
中图分类号: (Electrical and electronic instruments and components)
- 07.50.-e