中国物理B ›› 2021, Vol. 30 ›› Issue (12): 120701-120701.doi: 10.1088/1674-1056/ac05af
Huali Zhu(朱华利), Yong Zhang(张勇)†, Kun Qu(屈坤), Haomiao Wei(魏浩淼), Yukun Li(黎雨坤), Yuehang Xu(徐跃杭), and Ruimin Xu(徐锐敏)
Huali Zhu(朱华利), Yong Zhang(张勇)†, Kun Qu(屈坤), Haomiao Wei(魏浩淼), Yukun Li(黎雨坤), Yuehang Xu(徐跃杭), and Ruimin Xu(徐锐敏)
摘要: This article presents the design and performance of a terahertz on-chip coupled-grounded coplanar waveguide (GCPW) power combiner using a 50 μm-thick InP process. The proposed topology uses two coupled-GCPW lines at the end of the input port to substitute two quarter-wavelength GCPW lines, which is different from the conventional Wilkinson power combiner and can availably minimize the coverage area. According to the results obtained, for the frequency range of 210-250 GHz, the insertion losses for each two-way combiner and four-way combiner were lower than 1.05 dB and 1.35 dB, respectively, and the in-band return losses were better than 11 dB. Moreover, the proposed on-chip GCPW-based combiners achieved a compromise in low-loss, broadband, and small-size, which can find wide applications in terahertz bands, such as power amplifiers and signal distribution networks.
中图分类号: (Electrical and electronic instruments and components)