中国物理B ›› 2005, Vol. 14 ›› Issue (5): 1006-1010.doi: 10.1088/1009-1963/14/5/026

• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇    下一篇

Internal stress and yield strength of copper films on substrates

张建民1, 张研1, 徐可为2   

  1. (1)College of Physics and Information Technology, Shaanxi Normal University, Xi’an 710062, China; (2)State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
  • 收稿日期:2003-12-23 修回日期:2004-12-16 出版日期:2005-05-19 发布日期:2005-05-19
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant No 50271038)

Internal stress and yield strength of copper films on substrates

Zhang Jian-Min (张建民)a, Zhang Yan (张研)a, Xu Ke-Wei (徐可为)b   

  1. a College of Physics and Information Technology, Shaanxi Normal University, Xi’an 710062, China; b State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
  • Received:2003-12-23 Revised:2004-12-16 Online:2005-05-19 Published:2005-05-19
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant No 50271038)

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摘要： Internal stress and yield strength of pure copper films on substrates were characterized by X-ray diffraction and thermal-cycle substrate curvature methods. The internal stress was of tension, and decreased with increasing working-gas (argon) pressure and increased with increasing film thickness. Tensile yield strength of copper film on steel substrate was reciprocal to the film thickness. Similarly, the compressive yield strength depended strongly on the film thickness, the thinner the film thickness, the larger the compressive yield strength.

Abstract: Internal stress and yield strength of pure copper films on substrates were characterized by X-ray diffraction and thermal-cycle substrate curvature methods. The internal stress was of tension, and decreased with increasing working-gas (argon) pressure and increased with increasing film thickness. Tensile yield strength of copper film on steel substrate was reciprocal to the film thickness. Similarly, the compressive yield strength depended strongly on the film thickness, the thinner the film thickness, the larger the compressive yield strength.

Key words: copper film, internal stress, yield strength, X-ray diffraction, thermal-cycle substrate curvature

中图分类号: 

  • 6110