中国物理B ›› 2005, Vol. 14 ›› Issue (5): 1006-1010.doi: 10.1088/1009-1963/14/5/026
• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇 下一篇
张建民1, 张研1, 徐可为2
Zhang Jian-Min (张建民)a, Zhang Yan (张研)a, Xu Ke-Wei (徐可为)b
摘要: Internal stress and yield strength of pure copper films on substrates were characterized by X-ray diffraction and thermal-cycle substrate curvature methods. The internal stress was of tension, and decreased with increasing working-gas (argon) pressure and increased with increasing film thickness. Tensile yield strength of copper film on steel substrate was reciprocal to the film thickness. Similarly, the compressive yield strength depended strongly on the film thickness, the thinner the film thickness, the larger the compressive yield strength.
中图分类号: