Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

doi:10.1088/1674-1056/ab48dc

中国物理B ›› 2019, Vol. 28 ›› Issue (11): 114401-114401.doi: 10.1088/1674-1056/ab48dc

• ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS • 上一篇下一篇

Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

Huilong Yan(闫慧龙), Jinliang Yan(闫金良), Gang Zhao(赵刚)

1 Key Laboratory of Thermo-Fluid Science and Engineering(Ministry of Education), School of Energy and Power Engineering, Xi'an Jiaotong University, Xi'an 710049, China;
2 School of Physics and Optoelectronic Engineering, Ludong University, Yantai 264025, China

收稿日期:2019-04-15 修回日期:2019-09-23 出版日期:2019-11-05 发布日期:2019-11-05
通讯作者: Huilong Yan, Jinliang Yan E-mail:18742514109@163.com;yanjinliang8@sina.com
基金资助:
Project supported by the National Natural Science Foundation of China (Grant No. 11874191) and the Natural Science Foundation of Shandong Province, China (Grant No. ZR2016FM38).

Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

Huilong Yan(闫慧龙)¹, Jinliang Yan(闫金良)², Gang Zhao(赵刚)²

1 Key Laboratory of Thermo-Fluid Science and Engineering(Ministry of Education), School of Energy and Power Engineering, Xi'an Jiaotong University, Xi'an 710049, China;
2 School of Physics and Optoelectronic Engineering, Ludong University, Yantai 264025, China

Received:2019-04-15 Revised:2019-09-23 Online:2019-11-05 Published:2019-11-05
Contact: Huilong Yan, Jinliang Yan E-mail:18742514109@163.com;yanjinliang8@sina.com
Supported by:
Project supported by the National Natural Science Foundation of China (Grant No. 11874191) and the Natural Science Foundation of Shandong Province, China (Grant No. ZR2016FM38).

摘要/Abstract

摘要： Liquid metal alloys (LMAs) are the potential candidates of thermal interface materials (TIMs) for electronics cooling. In the present work, buffer layers of Ag, Ti, Cu, Ni, Mo, and W were deposited on polished Cu plates by DC magnetron sputtering, the contact angles of de-ionized water and diiodomethane on the buffer layers were measured by an easy drop shape analyzer and the surface free energies (SFEs) of the buffer layers were calculated by the Owens-Wendt-Kaelble equation. Samples were prepared by sandwiching the filmed Cu plates and LMAs. The thermal properties of the samples were measured by laser flash analysis method. The SFE of the buffer layer has a strong influence on the interface heat transfer, whereas the measurement temperature has no obvious effect on the thermal properties of the samples. As the SFE of the buffer layer increases, the wettability, thermal diffusivity, and thermal conductivity are enhanced, and the thermal contact resistance is decreased.

关键词: buffer layer, liquid metal alloy, thermal contact resistance, heat transfer, surface free energy

Abstract: Liquid metal alloys (LMAs) are the potential candidates of thermal interface materials (TIMs) for electronics cooling. In the present work, buffer layers of Ag, Ti, Cu, Ni, Mo, and W were deposited on polished Cu plates by DC magnetron sputtering, the contact angles of de-ionized water and diiodomethane on the buffer layers were measured by an easy drop shape analyzer and the surface free energies (SFEs) of the buffer layers were calculated by the Owens-Wendt-Kaelble equation. Samples were prepared by sandwiching the filmed Cu plates and LMAs. The thermal properties of the samples were measured by laser flash analysis method. The SFE of the buffer layer has a strong influence on the interface heat transfer, whereas the measurement temperature has no obvious effect on the thermal properties of the samples. As the SFE of the buffer layer increases, the wettability, thermal diffusivity, and thermal conductivity are enhanced, and the thermal contact resistance is decreased.

Key words: buffer layer, liquid metal alloy, thermal contact resistance, heat transfer, surface free energy

中图分类号: (Heat conduction)

44.10.+i

68.08.-p (Liquid-solid interfaces) 65.40.gp (Surface energy) 68.08.Bc (Wetting)

闫慧龙, 闫金良, 赵刚. Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy[J]. 中国物理B, 2019, 28(11): 114401-114401.

Huilong Yan(闫慧龙), Jinliang Yan(闫金良), Gang Zhao(赵刚). Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy[J]. Chin. Phys. B, 2019, 28(11): 114401-114401.

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Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy

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