[1] Boucart K and Ionescu A M 2007 IEEE Trans. Electron. Devices 54 1725 [2] Chen Z X, Yu H Y, Singh N, Shen N S, Sayanthan R D, Lo G Q and Kwong D L 2009 IEEE Electron. Device Lett. 30 754 [3] Hu C M, Patel P, Bowonder A, Jeon K, Kim S H, Wei Y L, Chang Y K, Jungwoo O, Majhi P, Javey A, Liu T J K and Jammy R 2010 International Electron Devices Meeting, December 6-8, 2010, San Francisco, CA, USA, p. 16.1.1 [4] Omura Y, Mallik A and Matsuo N 2017 MOS Devices for Low-Voltage and Low-Energy Applications (Singapore: John Wiley & Sons) pp. 53-80 [5] Avci U E, Morris D H and Young I A 2015 IEEE J. Electron. Devices Soc. 3 88 [6] Saurabh S and Kumar M J 2011 IEEE Trans. Electron. Devices 58 404 [7] Lu H and Seabaugh A 2014 IEEE J. Electron. Devices Soc. 2 44 [8] Rajoriya A, Shrivastava M, Gossner H, Schulz T and Rao V R 2013 IEEE Trans. Electron. Devices 60 2626 [9] Ionescu A M and Riel H 2011 Nature 479 329 [10] Yoon Y J, Woo S Y, Seo J H, Lee J S, Park Y S, Lee J H and Kang I M 2012 J. Korean Phys. Soc. 61 1679 [11] Chatterjee N, Gupta A and Pandey S 2016 International Conference on Computational Techniques in Information and Communication Technologies (ICCTICT), March 11-13, 2016, New Delhi, India, p. 118 [12] Kumar N and Raman A 2020 Silicon 12 2627 [13] Kim S W, Kim J H, Liu T J K, Choi W Y and Park B G 2016 IEEE Trans. Electron. Devices 63 1774 [14] Li C, Zhao X L, Zhuang Y Q, Yan Z R, Guo J M and Han R 2018 Superlattices Microstruct. 115 154 [15] Liu K M and Cheng C P 2020 IEEE Trans. Nanotechnol 19 382 [16] Dubey P K, Kaushik B K 2017 IEEE Trans. Electron. Devices 64 3120 [17] Choi W Y and Lee W 2010 IEEE Trans. Electron. Devices 57 2317 [18] Li C, Yan Z R, Zhuang Y Q, Zhao X L and Guo J M 2018 Chin. Phys. B 27 078502 [19] Lee J W and Choi W Y 2020 IEEE Access 8 67617 [20] Avci U E and Young I A 2013 IEEE International Electron Devices Meeting, December 9-11, 2013, Washington, DC, USA, p. 4.3.1 [21] Lu Y Q, Zhou G L, Li R, Liu Q M, Zhang Q, Vasen T, Chae S D, Kosel T, Wistey M, Xing H L, Seabaugh A and Fay P 2012 IEEE Electron. Device Lett. 33 655 [22] Tomioka K, Yoshimura M and Fukui T 2012 Symposium on VLSI Technology (VLSIT), June 12-14 2012, Honolulu, HI, USA, p. 47 [23] Cui N, Liang R R and Xu J 2011 Appl. Phys. Lett. 98 142105 [24] Beneventi G B, Gnani E, Gnudi A, Reggiani S and Baccarani G 2015 IEEE Trans. Electron. Devices 62 44 [25] Seabaugh A C and Zhang Q 2010 Proc. IEEE Inst. Electr. Electron. Eng. 98 2095 [26] Nagavarapu V, Jhaveri R and Woo J C S 2008 IEEE Trans. Electron. Devices 55 1013 [27] Jhaveri R, Nagavarapu V and Woo J C S 2011 IEEE Trans. Electron. Devices 58 80 [28] Li W C and Woo J C S 2018 IEEE Trans. Electron. Devices 65 5289 [29] Kao K H, Verhulst A S, Vandenberghe W G, Soree B, Magnus W, Leonelli D, Groeseneken G and Meyer K De 2012 IEEE Trans. Electron. Devices 59 2070 [30] Abdi D B and Kumar M J 2014 IEEE Electron. Device Lett. 35 1170 [31] Sahoo S, Dash S, Routray S R and Mishra G P 2021 Int. J. Numer. Model. El. 34 e2808 [32] Li W C and Woo J C S 2020 IEEE Trans. Electron. Devices 67 1480 [33] Yang Z N 2016 IEEE Electron. Device Lett. 37 839 [34] Bhuwalka K K, Schulze J and Eisele I 2005 IEEE Trans. Electron. Devices 52 1541 [35] Xie H W and Liu H X 2020 AIP Adv. 10 055125 [36] Dharmender and Nigam K 2020 Silicon 13 2347 [37] Singh A K, Tripathy M R, Baral K, Singh P K and Jit S 2020 Microelectron. J. 102 104775 |