中国物理B ›› 2018, Vol. 27 ›› Issue (11): 110701-110701.doi: 10.1088/1674-1056/27/11/110701

• SPECIAL TOPIC—Recent advances in thermoelectric materials and devices • 上一篇    下一篇

Effect of different bending shapes on thermal properties of flexible light-emitting diode filament

Liping Wang(王立平), Wenbo Li(李文博), Yichao Xu(徐一超), Bobo Yang(杨波波), Mingming Shi(石明明), Jun Zou(邹军), Yang Li(李杨), Xinglu Qian(钱幸璐), Fei Zheng(郑飞), Lei Yang(杨磊)   

  1. 1 School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai 201418, China;
    2 School of Science, Shanghai Institute of Technology, Shanghai 201418, China;
    3 Zhejiang Emitting Optoelectronic Technology Co., LTD, Jiaxing 310000, China
  • 收稿日期:2018-06-20 修回日期:2018-09-05 出版日期:2018-11-05 发布日期:2018-11-05
  • 通讯作者: Jun Zou, Yang Li E-mail:zoujun@sit.edu.cn;liyang123@sit.edu.cn
  • 基金资助:

    Project supported by the National Natural Science Foundation of China (Grant No. 51302171), Science and Technology Commission of Shanghai Municipality, China (Grant No. 14500503300), Shanghai Municipal Alliance Program, China (Grant No. Lm201547), Shanghai Cooperative Project, China (Grant No. ShanghaiCXY-2013-61), and Jiashan County Technology Program, China (Grant No. 20141316).

Effect of different bending shapes on thermal properties of flexible light-emitting diode filament

Liping Wang(王立平)1, Wenbo Li(李文博)3, Yichao Xu(徐一超)1, Bobo Yang(杨波波)2, Mingming Shi(石明明)2, Jun Zou(邹军)2, Yang Li(李杨)1, Xinglu Qian(钱幸璐)1, Fei Zheng(郑飞)1, Lei Yang(杨磊)3   

  1. 1 School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai 201418, China;
    2 School of Science, Shanghai Institute of Technology, Shanghai 201418, China;
    3 Zhejiang Emitting Optoelectronic Technology Co., LTD, Jiaxing 310000, China
  • Received:2018-06-20 Revised:2018-09-05 Online:2018-11-05 Published:2018-11-05
  • Contact: Jun Zou, Yang Li E-mail:zoujun@sit.edu.cn;liyang123@sit.edu.cn
  • Supported by:

    Project supported by the National Natural Science Foundation of China (Grant No. 51302171), Science and Technology Commission of Shanghai Municipality, China (Grant No. 14500503300), Shanghai Municipal Alliance Program, China (Grant No. Lm201547), Shanghai Cooperative Project, China (Grant No. ShanghaiCXY-2013-61), and Jiashan County Technology Program, China (Grant No. 20141316).

摘要:

Heat dissipation is an important part of light-emitting diode (LED) filament research and has aroused constant concern. In this paper, we studied the thermal performance of flexible LED filament by numerical simulation and through experiment. The heat dissipation characteristics of spring-like structure flexible LED filament were computed by finite volume method, and it was found that the chip junction temperature was closely related to the pitch and the bending radius. The effect of inclination angle of lighting LED filament was discussed because it is relevant to the spring-like structure flexible LED filament in geometry. The results demonstrated that the temperature of the filament increases as the inclination angle improves.

关键词: flexible light-emitting diode filament, heat dissipation, numerical simulation, spring-like

Abstract:

Heat dissipation is an important part of light-emitting diode (LED) filament research and has aroused constant concern. In this paper, we studied the thermal performance of flexible LED filament by numerical simulation and through experiment. The heat dissipation characteristics of spring-like structure flexible LED filament were computed by finite volume method, and it was found that the chip junction temperature was closely related to the pitch and the bending radius. The effect of inclination angle of lighting LED filament was discussed because it is relevant to the spring-like structure flexible LED filament in geometry. The results demonstrated that the temperature of the filament increases as the inclination angle improves.

Key words: flexible light-emitting diode filament, heat dissipation, numerical simulation, spring-like

中图分类号:  (Design of experiments)

  • 07.05.Fb
07.05.Tp (Computer modeling and simulation)