| [1] |
Tang J, Wang H T, Lee D H, Fardy M, Huo H Z, Russell T P and Yang P 2010 Nano Lett. 10 4279
|
| [2] |
Lin Z Z, Huang C L and Huang Z 2017 J. Nanosci. Nanotechnol. 17 1
|
| [3] |
Dresselhaus M S, Chen G, Tang M Y, Yang R G, Lee H, Wang D Z, Ren Z F, Fleurial J P and Gogna P 2007 Adv. Mater. 19 1043
|
| [4] |
Lin Z Z, Huang C L, Zhen W K, Feng Y H, Zhang X X and Wang G 2017 Nanoscale Res. Lett. 12 189
|
| [5] |
Liu H, Li Z Y, Zhao X P and Tao W Q 2015 J. Nanosci. Nanotechnol. 15 3218
|
| [6] |
Huang C L, Lin Z Z, Feng Y H, Zhang X X and Wang G 2015 Eur. Phys. J. Plus 130 239
|
| [7] |
Li Z Y, Liu H, Zhao X P, and Tao W Q 2015 J. Non-Cryst. Solids 430 43
|
| [8] |
Feng D L, Feng Y H and Shi J 2016 Acta Phys. Sin. 65 244401(in Chinese)
|
| [9] |
Liu H, Li Z Y, Zhao X P and Tao W Q 2016 Int. J. Heat Mass Transfer 95 1026
|
| [10] |
Zhang C B, Shen C Q and Chen Y P 2017 Int. J. Heat Mass Transfer 104 1135
|
| [11] |
Yu W and Xie H 2011 J. Nanomater. 2012 435873
|
| [12] |
Kulwinder K and Ranjan K 2016 Chin. Phys. B 25 056401
|
| [13] |
Yu W, Xie H, Yin L, Zhao J, Xia L and Chen L 2015 Int. J. Therm. Sci. 91 76
|
| [14] |
Rayleigh L 1976 Philos. Mag. 34 481
|
| [15] |
Prasher R S and Phelan P E 1999 J. Heat Transfer 123 105
|
| [16] |
Lotfizadeh S and Matsoukas T 2015 J. Nanopart. Res. 17 1
|
| [17] |
Eapen J, Rusconi R, Piazza R and Yip S 2010 J. Heat Transfer 132 369
|
| [18] |
Progelhof R C 1976 Polym. Eng. Sci. 16 615
|
| [19] |
Choi C J and Roberts N 2016 Int. J. Therm. Sci. 104 13
|
| [20] |
Siddiqui M U and Arif A F M 2016 Materials 9 694
|
| [21] |
Huang C L, Feng Y H, Zhang X X and Wang G 2014 Eur. Phys. J. Appl. Phys. 66 67
|
| [22] |
LotfizadehS and Desa T 2014 APL Mater. 2 066102
|
| [23] |
Huang C L, Qian X and Yang R G 2017 EPL 117 24001
|
| [24] |
Wang B X, Wang Zhou L P and Peng X F 2003 Int. J. Heat Mass Transfer 46 2665
|
| [25] |
Li X, Park W, Chen Y P and Ruan X L 2017 J. Heat Transfer 139 022401
|
| [26] |
Lin Z Z, Huang C L, Zhen W K and Huang Z 2017 Appl. Therm. Eng. 119 425
|
| [27] |
Huai X L, Tao Y J and Wang W W 2006 Chin. Phys. Lett. 23 1511
|
| [28] |
Xuan Y M and Li Q 2000 Int. J. Heat Fluid Fl. 21 58
|
| [29] |
Zhao D L, Qian X, Gu X K, Jajia S A and Yang R G 2016 J. Electronic Packaging 138 040802
|
| [30] |
Huang C L, Feng Y H, Zhang X X, Li J, Wang G and Chou A H 2013 Acta Phys. Sin. 63 026501(in Chinese)
|
| [31] |
Ordonez-MirandaJ, Yang R G and Alvarado-GilJ J 2011 Appl. Phys. Lett. 98 233111
|
| [32] |
Dornhaus R, Nimtz P D G and Richter W 1976 Solid-State Physics (Germany:Springer Verlag)
|
| [33] |
Jiang W T, Ding G L, Peng H, Gao Y F and Wang K J 2009 HVAC & R Res. 15 651
|
| [34] |
Hwng Y J and Ahn Y C 2006 Curr. Appl. Phys. 6 1068
|
| [35] |
Machrafi H, Lebon G and Iorio C S 2016 Compos Sci. Technol. 130 78
|
| [36] |
Lee S and Choi S 1999 J. Heat Trans.-T ASME 121 280
|
| [37] |
Sim L C and Ramanan S R 2005 Thermochim. Acta 430 155
|