[1] |
Pae S, Ashok A,Choi J, Ghani T, He J, Lee S H, Lemay K, Liu M, Lu R, Packan P, Parker C, Purser R, Amour A S and Woolery B 2010 48th Annual Proceedings: International Reliability Physics Symposium, May 2-6, 2010, Anaheim, USA, p. 287
|
[2] |
Pae S, Agostinelli M, Chau R, Dewey G, Ghani T, Hattendorf M, Hicks J, Kavalieros J, Kuhn K, Kuhn M, Maiz J, Metz M, Mistry K, Prasad C, Ramey S, Roskowski A, Standford J, Thomas C, Wiegand C and Wiedemer J 2008 46th Annual Proceedings: International Reliability Physics Symposium, April 27-May 1, 2008, Anaheim, USA, p. 352
|
[3] |
Robertson J 2004 Eur. Phys. J. Appl. Phys. 28 265
|
[4] |
Wilk G D, Wallace R M and Anthony J M 2001 J. Appl. Phys. 89 5243
|
[5] |
Zhang Y, Zhuo Q Q, Liu H X, Ma X H and Hao Y 2014 Chin. Phys. B 23 057304
|
[6] |
Lerous C, Mitard J, Ghibaudo G, Garros X, Reimbold G, Guillaumot B and Martin F 2004 IEDM Tech. Dig. p. 737
|
[7] |
Young C D, Bersuker G, Brown G A, Lim C, Lysaght P, Zeitzoff P, Murto R W and Huff H R 2003 Int. Integrated Reliability Workshop Final Report p. 28
|
[8] |
Pantisano L, Cartier E, Kerber A, Degraeve R, Lorenzini M, Rosmeulen M, Groeseneken G and Maes H E 2003 VLSI Tech. Dig. p 163
|
[9] |
Ribes G, Muller M, Bruyere S, Roy D, Denais M, Huard V, Skotnicki T and Ghibaudo G 2004 Proc. European Solid-State Device Research Conference p. 89
|
[10] |
Garros X, Brunet L, Rafic M, Coignus J, Reimbold G, Vincent E, Bravaix A and Boulanger F 2010 IEDM Tech. Dig. p. 90
|
[11] |
Lee S K, Jo M, Sohn C W, Kang C Y, Lee J C, Jeong Y H and Lee B H 2012 IEEE Electron Device Lett. 33 1517
|
[12] |
Cho M, Aoulaiche M, Degraeve R, Kaczer B, Franco J, Kauerauf T, Roussel P, Ragnarsson L A, Tseng J, Hoffmann T Y and Groeseneken G 2010 48th Annual Proceedings: International Reliability Physics Symposium p. 1095
|
[13] |
Zhang J F and Eccleston W 1998 IEEE Trans. Electron Devices 45 116
|
[14] |
Hauser J R and Ahmed K 1998 Proc. Int. Conf. Characterizat. Metrol. ULSI Technol. p. 235
|
[15] |
Tan C H, Xu M Z and Wang Y Y 1994 IEEE Electron Device Lett. 15 257
|
[16] |
Ren S Q, Yang H, Tang B, Xu H, Luo W C, Tang Z Y, Xu Y F, Xu J, Wang D H, Li J F, Yan J, Zhao C, Chen D P, Ye T C and Wang W W 2015 Journal of Semiconductors 36 014007
|
[17] |
Zhang J F 2009 Microelectronic Eng. 86 1883
|
[18] |
Degrave R, Aoulaiche M, Kazer B, Roussel P, Kauerauf T, Sahhaf S and Groesenken 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits p. 1
|
[19] |
Kerber A and Cartier N G 2009 Trans. Device Material Reliability 9 147
|
[20] |
Sayan S, Garfunkel E and Suzer S 2002 Appl. Phys. Lett. 80 2135
|
[21] |
Robertson J 2000 J. Vac. Sci. Technol. B 18 1785
|
[22] |
Foster A S, Gejo F L, Shluger A L and Niminen R M 2002 Phys. Rev. B 65 174117
|