中国物理B ›› 2014, Vol. 23 ›› Issue (6): 66102-066102.doi: 10.1088/1674-1056/23/6/066102

• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇    下一篇

Electrohydrodynamic direct-writing of conductor-insulator-conductor multi-layer interconnection

郑高峰a, 裴艳博a b, 王翔a, 郑建毅a, 孙道恒a   

  1. a Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China;
    b School of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin 150001, China
  • 收稿日期:2013-09-12 修回日期:2014-01-04 出版日期:2014-06-15 发布日期:2014-06-15
  • 基金资助:
    Project supported by the Key Program of the National Natural Science Foundation of China (Grant No. 51035002), the National Natural Science Foundation of China (Grant No. 51305373), and the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20120121120035).

Electrohydrodynamic direct-writing of conductor-insulator-conductor multi-layer interconnection

Zheng Gao-Feng (郑高峰)a, Pei Yan-Bo (裴艳博)a b, Wang Xiang (王翔)a, Zheng Jian-Yi (郑建毅)a, Sun Dao-Heng (孙道恒)a   

  1. a Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China;
    b School of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin 150001, China
  • Received:2013-09-12 Revised:2014-01-04 Online:2014-06-15 Published:2014-06-15
  • Contact: Zheng Jian-Yi E-mail:zjy@xmu.edu.cn
  • Supported by:
    Project supported by the Key Program of the National Natural Science Foundation of China (Grant No. 51035002), the National Natural Science Foundation of China (Grant No. 51305373), and the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20120121120035).

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摘要： A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor-insulator-conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34×10-7 Ω·m and 1.39×10-7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor-insulator-conductor multi-layer interconnections in the electronic industry.

关键词: electrohydrodynamic direct-writing, multi-layer interconnection, all inkjet printing, jet printing

Abstract: A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor-insulator-conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34×10-7 Ω·m and 1.39×10-7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor-insulator-conductor multi-layer interconnections in the electronic industry.

Key words: electrohydrodynamic direct-writing, multi-layer interconnection, all inkjet printing, jet printing

中图分类号:  (Microconfined liquid crystals: droplets, cylinders, randomly confined liquid crystals, polymer dispersed liquid crystals, and porous systems)

  • 61.30.Pq
81.16.-c (Methods of micro- and nanofabrication and processing) 85.40.-e (Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology) 94.20.Ss (Electric fields; current system)