中国物理B ›› 2004, Vol. 13 ›› Issue (2): 205-211.doi: 10.1088/1009-1963/13/2/015

• CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES • 上一篇    下一篇

Yield strengths and stress induced crackles in copper films: effects of substrate and passivated layer

张建民1, 徐可为2   

  1. (1)College of Physics and Information Technology, Shaanxi Normal University, Xi'an 710062, China; (2)State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China
  • 收稿日期:2003-06-06 修回日期:2003-08-11 出版日期:2005-07-06 发布日期:2005-07-06
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant Nos 50271038 and 59931010).

Yield strengths and stress induced crackles in copper films: effects of substrate and passivated layer

Zhang Jian-Min (张建民)a, Xu Ke-Wei (徐可为)b   

  1. a College of Physics and Information Technology, Shaanxi Normal University, Xi'an 710062, China; b State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China
  • Received:2003-06-06 Revised:2003-08-11 Online:2005-07-06 Published:2005-07-06
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant Nos 50271038 and 59931010).

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摘要： Yield strengths in unpassivated and 530 nm TiN passivated Cu films deposited on Ti, high-speed steel and Ni substrates have been measured by x-ray diffraction (XRD) in combination with the four-point bending method. The results show that, although the texture and average grain size, investigated by XRD and transmission electron microscopy respectively, do not vary with different substrate, the yield strength of the Cu film increases obviously when a thin passivated layer is present and varies slightly with substrates. Many crackles appear in the passivated Cu film on Ti substrate but do not appear in other samples. The experimental results have been explained satisfactorily with an expression for the yield strength of thin films given previously.

Abstract: Yield strengths in unpassivated and 530 nm TiN passivated Cu films deposited on Ti, high-speed steel and Ni substrates have been measured by x-ray diffraction (XRD) in combination with the four-point bending method. The results show that, although the texture and average grain size, investigated by XRD and transmission electron microscopy respectively, do not vary with different substrate, the yield strength of the Cu film increases obviously when a thin passivated layer is present and varies slightly with substrates. Many crackles appear in the passivated Cu film on Ti substrate but do not appear in other samples. The experimental results have been explained satisfactorily with an expression for the yield strength of thin films given previously.

Key words: copper film, microstructure, yield strength, crackles

中图分类号:  (Deformation and plasticity)

  • 62.20.F-
81.40.Lm (Deformation, plasticity, and creep) 81.40.Np (Fatigue, corrosion fatigue, embrittlement, cracking, fracture, and failure) 81.65.Rv (Passivation) 68.37.Lp (Transmission electron microscopy (TEM)) 73.61.At (Metal and metallic alloys)